公开(公告)号：US20240266316A1

公开(公告)日：2024-08-08

申请号：US18328982

申请日：2023-06-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yu Chen ,  Ching-Hua Hsieh ,  Hsiu-Jen Lin ,  Hao-Jan Pei ,  Chao-Wei Chiu ,  Hsin Liang Chen

IPC: H01L23/00

CPC classification number: H01L24/73 ,  H01L24/11 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/1184 ,  H01L2224/16145 ,  H01L2224/2784 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/9211

Abstract: An embodiment is a device including a substrate comprising conductive pads, a package component bonded to the conductive pads of the substrate with solder connectors, the package component comprising an integrated circuit die, the integrated circuit die comprising die connectors, one of the solder connectors coupled to each of the die connectors and a corresponding conductive pad of the substrate, a first dielectric layer laterally surrounding each of the die connectors and a portion of the solder connectors, and a second dielectric layer being between the first dielectric layer and the substrate, the second dielectric layer laterally surrounding each of the conductive pads of the substrate.

公开(公告)号：US20240387346A1

公开(公告)日：2024-11-21

申请号：US18366255

申请日：2023-08-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chiang Tsao ,  Chao-Wei Chiu ,  Hsin Liang Chen ,  Chia-Shen Cheng ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

Abstract: Embodiments include a device. The device includes an interposer, a package substrate, and conductive connectors bonding the package substrate to the interposer. Each of the conductive connectors have convex sidewalls. A first subset of the conductive connectors are disposed in a center of the package substrate in a top-down view. A second subset of the conductive connectors are disposed in an edge/corner of the package substrate in the top-down view. Each of the second subset of the conductive connectors have a greater height than each of the first subset of the conductive connectors.

公开(公告)号：US20240339424A1

公开(公告)日：2024-10-10

申请号：US18230793

申请日：2023-08-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yu Chen ,  Chao-Wei Chiu ,  Hsin Liang Chen ,  Hao-Jan Pei ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2924/01322

Abstract: Embodiments provide a device structure and method of forming a device structure including an infill structure to capture solder materials within confines of openings of the infill structure. Metal pillars of one device can penetrate through a non-conductive film and contact solder regions of another device. A separate underfill is not needed.