公开(公告)号：US09527721B2

公开(公告)日：2016-12-27

申请号：US14713243

申请日：2015-05-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shyh-Wei Cheng ,  Chao-Po Lu ,  Chung-Hsien Hun ,  Chih-Shan Chen ,  Chuan-Yi Ko ,  Chih-Yu Wang ,  Hsi-Cheng Hsu ,  Ji-Hong Chiang ,  Jui-Chun Weng ,  Wei-Ding Wu

IPC: H04R23/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0005 ,  B81B3/001 ,  B81B2201/0235 ,  B81B2207/012 ,  B81C1/00984 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/035 ,  B81C2203/036 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/81805 ,  H01L2924/1461 ,  H01L2924/16235

Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.

Abstract translation: 本公开涉及具有抗静电层的微机电系统（MEMS）封装以及相关联的形成方法。 在一些实施例中，MEMS封装包括器件衬底和CMOS衬底。 器件衬底包括具有相对于器件衬底可移动或柔性的可移动或柔性部件的MEMS器件。 可移动或柔性部分的表面由多晶硅制成的共形抗静电层涂覆。 还提供了一种制造MEMS封装的方法。

公开(公告)号：US20160332863A1

公开(公告)日：2016-11-17

申请号：US14713243

申请日：2015-05-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shyh-Wei Cheng ,  Chao-Po Lu ,  Chung-Hsien Hun ,  Chih-Shan Chen ,  Chuan-Yi Ko ,  Chih-Yu Wang ,  Hsi-Cheng Hsu ,  Ji-Hong Chiang ,  Jui-Chun Weng ,  Wei-Ding Wu

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0005 ,  B81B3/001 ,  B81B2201/0235 ,  B81B2207/012 ,  B81C1/00984 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/035 ,  B81C2203/036 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/81805 ,  H01L2924/1461 ,  H01L2924/16235

Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.

Abstract translation: 本公开涉及具有抗静电层的微机电系统（MEMS）封装以及相关联的形成方法。 在一些实施例中，MEMS封装包括器件衬底和CMOS衬底。 器件衬底包括具有相对于器件衬底可移动或柔性的可移动或柔性部件的MEMS器件。 可移动或柔性部分的表面由多晶硅制成的共形抗静电层涂覆。 还提供了一种制造MEMS封装的方法。