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公开(公告)号：US09090452B2
公开(公告)日：2015-07-28
申请号：US14098974
申请日：2013-12-06
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
Inventor： Shyh-Wei Cheng , Jui-Chun Weng , Hsi-Cheng Hsu , Chih-Yu Wang , Chuan-Yi Ko , Ji-Hong Chiang , Chung-Hsien Hung , Hsin-Yu Chen , Chih-Hsien Chen , Yu-Mei Wu , Jong Chen
CPC classification number: B81B3/001 , B81B3/0005
Abstract: Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS substrate disposed on the substrate. The MEMS substrate includes a movable element, a fixed element and at least a spring connected to the movable element and the fixed element. The MEMS device also includes a polysilicon layer on the movable element.
Abstract translation: 提供了用于形成微机电系统（MEMS）装置的机构的实施例。 MEMS器件包括设置在衬底上的衬底和MEMS衬底。 MEMS基板包括可移动元件，固定元件和连接到可移动元件和固定元件的至少一个弹簧。 MEMS器件还包括可移动元件上的多晶硅层。
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公开(公告)号：US09527721B2
公开(公告)日：2016-12-27
申请号：US14713243
申请日：2015-05-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Shyh-Wei Cheng , Chao-Po Lu , Chung-Hsien Hun , Chih-Shan Chen , Chuan-Yi Ko , Chih-Yu Wang , Hsi-Cheng Hsu , Ji-Hong Chiang , Jui-Chun Weng , Wei-Ding Wu
CPC classification number: B81B3/0005 , B81B3/001 , B81B2201/0235 , B81B2207/012 , B81C1/00984 , B81C2203/0109 , B81C2203/0118 , B81C2203/035 , B81C2203/036 , B81C2203/0785 , B81C2203/0792 , H01L2224/81805 , H01L2924/1461 , H01L2924/16235
Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.
Abstract translation: 本公开涉及具有抗静电层的微机电系统（MEMS）封装以及相关联的形成方法。 在一些实施例中，MEMS封装包括器件衬底和CMOS衬底。 器件衬底包括具有相对于器件衬底可移动或柔性的可移动或柔性部件的MEMS器件。 可移动或柔性部分的表面由多晶硅制成的共形抗静电层涂覆。 还提供了一种制造MEMS封装的方法。
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公开(公告)号：US20160332863A1
公开(公告)日：2016-11-17
申请号：US14713243
申请日：2015-05-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Shyh-Wei Cheng , Chao-Po Lu , Chung-Hsien Hun , Chih-Shan Chen , Chuan-Yi Ko , Chih-Yu Wang , Hsi-Cheng Hsu , Ji-Hong Chiang , Jui-Chun Weng , Wei-Ding Wu
CPC classification number: B81B3/0005 , B81B3/001 , B81B2201/0235 , B81B2207/012 , B81C1/00984 , B81C2203/0109 , B81C2203/0118 , B81C2203/035 , B81C2203/036 , B81C2203/0785 , B81C2203/0792 , H01L2224/81805 , H01L2924/1461 , H01L2924/16235
Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.
Abstract translation: 本公开涉及具有抗静电层的微机电系统（MEMS）封装以及相关联的形成方法。 在一些实施例中，MEMS封装包括器件衬底和CMOS衬底。 器件衬底包括具有相对于器件衬底可移动或柔性的可移动或柔性部件的MEMS器件。 可移动或柔性部分的表面由多晶硅制成的共形抗静电层涂覆。 还提供了一种制造MEMS封装的方法。
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