公开(公告)号：US20230401885A1

公开(公告)日：2023-12-14

申请号：US18232756

申请日：2023-08-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： You-Cheng JHANG ,  Han-Zong PAN ,  Wei-Ding WU ,  Jiu-Chun WENG ,  Hsin-Yu CHEN ,  Cheng-San CHOU ,  Chin-Min LIN

IPC: G06V40/13 ,  G02B27/30 ,  G06F3/041 ,  G06F21/32 ,  H01L27/146

CPC classification number: G06V40/13 ,  G02B27/30 ,  G06F3/0412 ,  G06F21/32 ,  H01L27/14625

Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.

公开(公告)号：US20230092567A1

公开(公告)日：2023-03-23

申请号：US17993319

申请日：2022-11-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： You-Cheng JHANG ,  Han-Zong PAN ,  Wei-Ding WU ,  Jiu-Chun WENG ,  Hsin-Yu CHEN ,  Cheng-San CHOU ,  Chin-Min LIN

IPC: G06V40/13 ,  G06F3/041 ,  G02B27/30 ,  H01L27/146 ,  G06F21/32

Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.

公开(公告)号：US20150227050A1

公开(公告)日：2015-08-13

申请号：US14176314

申请日：2014-02-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chin-Min LIN ,  De-Fang HUANG ,  Ching-Hui TSAO

IPC: G03F7/40 ,  H01L21/67 ,  H01L21/66 ,  H01L21/027

CPC classification number: G03F7/40 ,  F27B5/14 ,  F27B17/0025 ,  H01L21/0271 ,  H01L21/67103 ,  H01L21/67115 ,  H01L21/67748

Abstract: In accordance with some embodiments, a method and an apparatus for baking photoresist patterns are provided. The method includes putting a wafer over a heating assembly. A photoresist pattern is formed over a top surface of the wafer. The method further includes curing the wafer from the top surface of the wafer by a curing assembly while heating the wafer from a bottom surface of the wafer by a heating assembly.

Abstract translation: 根据一些实施例，提供了一种用于烘烤光刻胶图案的方法和设备。 该方法包括将晶片放在加热组件上。 在晶片的顶表面上形成光刻胶图形。 该方法还包括通过固化组件从晶片的顶表面固化晶片，同时通过加热组件从晶片的底表面加热晶片。