公开(公告)号：US20240321613A1

公开(公告)日：2024-09-26

申请号：US18679252

申请日：2024-05-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Peng-Ren Chen ,  Wen-Hao Cheng ,  Jyun-Hong Chen ,  Chien-Hui Chen

IPC: H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67288 ,  H01L22/14

Abstract: Systematic fault localization systems and methods are provided which utilize computational GDS-assisted navigation to accelerate physical fault analysis to identify systematic fault locations and patterns. In some embodiments, a method includes detecting a plurality of electrical fault regions of a plurality of dies of a semiconductor wafer. Decomposed Graphic Database System (GDS) cross-layer clips are generated which are associated with the plurality of electrical fault regions. A plurality of cross-layer common patterns is identified based on the decomposed GDS cross-layer clips. Normalized differentials may be determined for each of the cross-layer common patterns, and locations of hotspots in each of the dies may be identified based on the determined normalized differentials.

公开(公告)号：US12027396B2

公开(公告)日：2024-07-02

申请号：US18163821

申请日：2023-02-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Peng-Ren Chen ,  Wen-Hao Cheng ,  Jyun-Hong Chen ,  Chien-Hui Chen

IPC: H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67288 ,  H01L22/14

Abstract: Systematic fault localization systems and methods are provided which utilize computational GDS-assisted navigation to accelerate physical fault analysis to identify systematic fault locations and patterns. In some embodiments, a method includes detecting a plurality of electrical fault regions of a plurality of dies of a semiconductor wafer. Decomposed Graphic Database System (GDS) cross-layer clips are generated which are associated with the plurality of electrical fault regions. A plurality of cross-layer common patterns is identified based on the decomposed GDS cross-layer clips. Normalized differentials may be determined for each of the cross-layer common patterns, and locations of hotspots in each of the dies may be identified based on the determined normalized differentials.

公开(公告)号：US20230178399A1

公开(公告)日：2023-06-08

申请号：US18163821

申请日：2023-02-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Peng-Ren Chen ,  Wen-Hao Cheng ,  Jyun-Hong Chen ,  Chien-Hui Chen

IPC: H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67288 ,  H01L22/14

Abstract: Systematic fault localization systems and methods are provided which utilize computational GDS-assisted navigation to accelerate physical fault analysis to identify systematic fault locations and patterns. In some embodiments, a method includes detecting a plurality of electrical fault regions of a plurality of dies of a semiconductor wafer. Decomposed Graphic Database System (GDS) cross-layer clips are generated which are associated with the plurality of electrical fault regions. A plurality of cross-layer common patterns is identified based on the decomposed GDS cross-layer clips. Normalized differentials may be determined for each of the cross-layer common patterns, and locations of hotspots in each of the dies may be identified based on the determined normalized differentials.

公开(公告)号：US11600505B2

公开(公告)日：2023-03-07

申请号：US16527435

申请日：2019-07-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Peng-Ren Chen ,  Wen-Hao Cheng ,  Jyun-Hong Chen ,  Chien-Hui Chen

IPC: H01L21/67 ,  H01L21/66

Abstract: Systematic fault localization systems and methods are provided which utilize computational GDS-assisted navigation to accelerate physical fault analysis to identify systematic fault locations and patterns. In some embodiments, a method includes detecting a plurality of electrical fault regions of a plurality of dies of a semiconductor wafer. Decomposed Graphic Database System (GDS) cross-layer clips are generated which are associated with the plurality of electrical fault regions. A plurality of cross-layer common patterns is identified based on the decomposed GDS cross-layer clips. Normalized differentials may be determined for each of the cross-layer common patterns, and locations of hotspots in each of the dies may be identified based on the determined normalized differentials.