公开(公告)号：US20210066226A1

公开(公告)日：2021-03-04

申请号：US16866562

申请日：2020-05-05

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chiang-Jui Chu ,  Ching-Wen Hsiao ,  Hao-Chun Liu ,  Ming-Da Cheng ,  Young-Hwa Wu ,  Tao-Sheng Chang

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L25/00

摘要： Electrical devices, semiconductor packages and methods of forming the same are provided. One of the electrical devices includes a substrate, a conductive pad, a conductive pillar and a solder region. The substrate has a surface. The conductive pad is disposed on the surface of the substrate. The conductive pillar is disposed on and electrically connected to the conductive pad, wherein a top surface of the conductive pillar is inclined with respect to the surface of the substrate. The solder region is disposed on the top surface of the conductive pillar.

公开(公告)号：US11282785B2

公开(公告)日：2022-03-22

申请号：US16927681

申请日：2020-07-13

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Hua Yu ,  Chiang-Jui Chu ,  Chung-Shi Liu ,  Hao-Yi Tsai ,  Ming Hung Tseng ,  Hung-Yi Kuo

IPC分类号： H01L29/00 ,  H01L23/522 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00 ,  H01L49/02 ,  H01L21/48 ,  H01L21/56 ,  H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L25/16 ,  H01L21/683

摘要： A package includes a device die, and an encapsulating material encapsulating the device die therein. The encapsulating material has a top surface coplanar with a top surface of the device die. A coil extends from the top surface to a bottom surface of the encapsulating material, and the device die is in the region encircled by the coil. At least one dielectric layer is formed over the encapsulating material and the coil. A plurality of redistribution lines is in the at least one dielectric layer. The coil is electrically coupled to the device die through the plurality of redistribution lines.

公开(公告)号：US20200343181A1

公开(公告)日：2020-10-29

申请号：US16927681

申请日：2020-07-13

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Hua Yu ,  Chiang-Jui Chu ,  Chung-Shi Liu ,  Hao-Yi Tsai ,  Ming Hung Tseng ,  Hung-Yi Kuo

IPC分类号： H01L23/522 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00 ,  H01L49/02 ,  H01L21/48 ,  H01L21/56 ,  H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L25/16 ,  H01L21/683

摘要： A package includes a device die, and an encapsulating material encapsulating the device die therein. The encapsulating material has a top surface coplanar with a top surface of the device die. A coil extends from the top surface to a bottom surface of the encapsulating material, and the device die is in the region encircled by the coil. At least one dielectric layer is formed over the encapsulating material and the coil. A plurality of redistribution lines is in the at least one dielectric layer. The coil is electrically coupled to the device die through the plurality of redistribution lines.