公开(公告)号：US20230290747A1

公开(公告)日：2023-09-14

申请号：US17826519

申请日：2022-05-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Hung Chen ,  Cheng-Pu Chiu ,  Chien-Chen Li ,  Chien-Li Kuo ,  Ting-Ting Kuo ,  Li-Hsien Huang ,  Yao-Chun Chuang ,  Jun He

IPC: H01L23/00 ,  H01L25/10 ,  H01L23/31 ,  H01L23/538 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L24/06 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/20 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2224/06519 ,  H01L2224/214 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094

Abstract: Embodiments provide metal features which dissipate heat generated from a laser drilling process for exposing dummy pads through a dielectric layer. Because the dummy pads are coupled to the metal features, the metal features act as a heat dissipation feature to pull heat from the dummy pad. As a result, reduction in heat is achieved at the dummy pad during the laser drilling process.