公开(公告)号：US20080239685A1

公开(公告)日：2008-10-02

申请号：US12056640

申请日：2008-03-27

Applicant: Tadahiko Kawabe ,  Masao Kuroda

Inventor： Tadahiko Kawabe ,  Masao Kuroda

IPC: H05K7/06

CPC classification number: H05K3/4046 ,  H01G4/232 ,  H01G4/30 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15312 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10712 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wiring board is comprised of a core board, a capacitor, a conductor containing portion and a laminated wiring portion. The core board has an accommodation hole. The capacitor has a through hole therein and is accommodated in the accommodation hole. The conductor containing portion has a current supplying conductor and is disposed in the through hole so as to be surrounded by the capacitor. The laminated wiring portion includes a component mounting region in which a first connection terminal electrically connected to the current supplying conductor is provided. Further, second connection terminals are disposed so as to sandwich the first connection terminal therebetween.

Abstract translation: 布线板由芯板，电容器，导体容纳部和层叠布线部构成。 核心板有一个住宿孔。 电容器在其中具有通孔并容纳在容纳孔中。 导体容纳部分具有供电导体，并且设置在通孔中以被电容器包围。 叠层布线部分包括其中设置有电连接到电流导体的第一连接端子的部件安装区域。 此外，第二连接端子被设置成将第一连接端子夹在其间。

公开(公告)号：US07704548B2

公开(公告)日：2010-04-27

申请号：US11739798

申请日：2007-04-25

Applicant: Tadahiko Kawabe ,  Masao Kuroda ,  Yasuhiro Sugimoto ,  Hajime Saiki ,  Shinji Yuri ,  Makoto Origuchi

Inventor： Tadahiko Kawabe ,  Masao Kuroda ,  Yasuhiro Sugimoto ,  Hajime Saiki ,  Shinji Yuri ,  Makoto Origuchi

IPC: B05D5/12 ,  H01B13/00

CPC classification number: H05K1/185 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2201/10712 ,  Y10T29/49155 ,  H01L2224/05599

Abstract: A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and fixing step, after accommodating the electronic component in an accommodation hole, a lowermost resin insulating layer is formed, and a gap between the electronic component and the core board is filled with a part of the lowermost resin insulating layer so as to fix the electronic component to the core board. In an opening portion formation step, a portion of the lowermost resin insulating layer located directly above the gap between the electronic component and the core board is removed so as to form an opening portion exposing a part of a core board main surface side conductor and a component main surface side electrode. In a main surface side connecting conductor formation step, a main surface side connecting conductor is formed in the opening portion so as to connect the core board main surface side conductor to the component main surface side electrode.

Abstract translation: 一种制造布线板的方法，其可以简化制造步骤。 在准备步骤中，制备核心板和电子部件。 在绝缘层形成和定影步骤中，在将电子部件容纳在容纳孔中之后，形成最下层的树脂绝缘层，并且用最下层的树脂绝缘层的一部分填充电子部件与芯板之间的间隙 以将电子部件固定到核心板。 在开口部形成工序中，除去位于电子部件与芯板之间的间隙正上方的最下层树脂绝缘层的一部分，以形成露出芯板主面侧导体和 部件主表面侧电极。 在主表面侧连接导体形成步骤中，在开口部分形成主表面侧连接导体，以将芯板主表面侧导体连接到部件主表面侧电极。

公开(公告)号：US07808799B2

公开(公告)日：2010-10-05

申请号：US11739752

申请日：2007-04-25

Applicant: Tadahiko Kawabe ,  Masao Kuroda ,  Yasuhiro Sugimoto ,  Hajime Saiki ,  Shinji Yuri ,  Makoto Origuchi

Inventor： Tadahiko Kawabe ,  Masao Kuroda ,  Yasuhiro Sugimoto ,  Hajime Saiki ,  Shinji Yuri ,  Makoto Origuchi

IPC: H05K1/16

CPC classification number: H05K1/185 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2224/05599

Abstract: A wiring board having an excellent electrical property and reliability or the like. The wiring board includes a core board, a capacitor and a resin filler. The core board includes an accommodation hole therein and a core board main surface side conductor disposed on the core main surface thereof. A capacitor main surface side electrode is disposed on a capacitor main surface of the capacitor. A gap between the capacitor accommodated in the accommodation hole and the core board is filled with the resin filler so that the capacitor is fixed to the core board. Further, the resin filler has a main surface side wiring forming portion on which a main surface side connecting conductor, which is connected to an end portion of a via conductor, is disposed so as to connect the core board main surface side conductor to the capacitor main surface side electrode.

Abstract translation: 具有优异的电性能和可靠性等的布线板。 布线板包括芯板，电容器和树脂填料。 芯板包括容纳孔和设置在其芯主表面上的芯板主表面侧导体。 电容器主面侧电极设置在电容器的电容器主表面上。 容纳在容纳孔中的电容器和芯板之间的间隙填充有树脂填料，使得电容器固定到芯板。 此外，树脂填料具有主表面侧布线形成部分，其上连接有通孔导体的端部的主表面侧连接导体，以将芯板主表面侧导体连接到电容器 主表面侧电极。

公开(公告)号：US20070281394A1

公开(公告)日：2007-12-06

申请号：US11739798

申请日：2007-04-25

Applicant: Tadahiko Kawabe ,  Masao Kuroda ,  Yasuhiro Sugimoto ,  Hajime Saiki ,  Shinji Yuri ,  Makoto Origuchi

Inventor： Tadahiko Kawabe ,  Masao Kuroda ,  Yasuhiro Sugimoto ,  Hajime Saiki ,  Shinji Yuri ,  Makoto Origuchi

IPC: H01L21/02

CPC classification number: H05K1/185 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2201/10712 ,  Y10T29/49155 ,  H01L2224/05599

Abstract: A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and fixing step, after accommodating the electronic component in an accommodation hole, a lowermost resin insulating layer is formed, and a gap between the electronic component and the core board is filled with a part of the lowermost resin insulating layer so as to fix the electronic component to the core board. In an opening portion formation step, a portion of the lowermost resin insulating layer located directly above the gap between the electronic component and the core board is removed so as to form an opening portion exposing a part of a core board main surface side conductor and a component main surface side electrode. In a main surface side connecting conductor formation step, a main surface side connecting conductor is formed in the opening portion so as to connect the core board main surface side conductor to the component main surface side electrode.

Abstract translation: 一种制造布线板的方法，其可以简化制造步骤。 在准备步骤中，制备核心板和电子部件。 在绝缘层形成和定影步骤中，在将电子部件容纳在容纳孔中之后，形成最下层的树脂绝缘层，并且用最下层树脂绝缘层的一部分填充电子部件与芯板之间的间隙 以将电子部件固定到核心板。 在开口部形成工序中，除去位于电子部件与芯板之间的间隙正上方的最下层树脂绝缘层的一部分，以形成露出芯板主面侧导体和 部件主表面侧电极。 在主表面侧连接导体形成步骤中，在开口部分形成主表面侧连接导体，以将芯板主表面侧导体连接到部件主表面侧电极。

公开(公告)号：US20070263364A1

公开(公告)日：2007-11-15

申请号：US11739752

申请日：2007-04-25

Applicant: Tadahiko Kawabe ,  Masao Kuroda ,  Yasuhiro Sugimoto ,  Hajime Saiki ,  Shinji Yuri ,  Makoto Origuchi

Inventor： Tadahiko Kawabe ,  Masao Kuroda ,  Yasuhiro Sugimoto ,  Hajime Saiki ,  Shinji Yuri ,  Makoto Origuchi

IPC: H05K7/00

CPC classification number: H05K1/185 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2224/05599

Abstract: A wiring board having an excellent electrical property and reliability or the like. The wiring board includes a core board, a capacitor and a resin filler. The core board includes an accommodation hole therein and a core board main surface side conductor disposed on the core main surface thereof. A capacitor main surface side electrode is disposed on a capacitor main surface of the capacitor. A gap between the capacitor accommodated in the accommodation hole and the core board is filled with the resin filler so that the capacitor is fixed to the core board. Further, the resin filler has a main surface side wiring forming portion on which a main surface side connecting conductor, which is connected to an end portion of a via conductor, is disposed so as to connect the core board main surface side conductor to the capacitor main surface side electrode.

Abstract translation: 具有优异的电性能和可靠性等的布线板。 布线板包括芯板，电容器和树脂填料。 芯板包括容纳孔和设置在其芯主表面上的芯板主表面侧导体。 电容器主面侧电极设置在电容器的电容器主表面上。 容纳在容纳孔中的电容器和芯板之间的间隙填充有树脂填料，使得电容器固定到芯板。 此外，树脂填料具有主表面侧布线形成部分，其上连接有通孔导体的端部的主表面侧连接导体，以将芯板主表面侧导体连接到电容器 主表面侧电极。

公开(公告)号：US20080149384A1

公开(公告)日：2008-06-26

申请号：US11944784

申请日：2007-11-26

Applicant: Tadahiko Kawabe

Inventor： Tadahiko Kawabe

IPC: H05K1/02 ,  H03K3/00

CPC classification number: H05K1/0219 ,  H01L23/49822 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/4046 ,  H05K3/4602 ,  H05K2201/096 ,  H05K2201/09809 ,  Y10T29/49155 ,  H01L2224/0401

Abstract: A multilayer wiring board capable of feeding sufficient electric power to a circuit element, such as an IC chip. In one embodiment of the present invention, a multilayer wiring board is comprised of: a core board; a build up layer disposed on an upper surface of the core board; a build up layer disposed on a lower surface of the core board; and a power supply structure embedded in a through hole penetrating the core board and the build up layers. The power supply structure is comprised of: a conductive metal rod made of copper as a main material; a conductive metal tube made of copper as a main material and provided coaxially with the conductive metal rod; and an insulating material filling a gap between the conductive metal rod and the conductive metal tube.

Abstract translation: 能够向诸如IC芯片的电路元件供给足够电力的多层布线板。 在本发明的一个实施例中，多层布线板包括：芯板; 设置在所述芯板的上表面上的堆积层; 设置在所述芯板的下表面上的堆积层; 以及嵌入贯穿核心板和构建层的通孔中的电源结构。 电源结构包括：以铜为主要材料的导电金属棒; 由铜作为主要材料制成并与导电金属棒同轴设置的导电金属管; 以及填充导电金属棒和导电金属管之间的间隙的绝缘材料。

公开(公告)号：US08093506B2

公开(公告)日：2012-01-10

申请号：US11944784

申请日：2007-11-26

Applicant: Tadahiko Kawabe

Inventor： Tadahiko Kawabe

IPC: H05K1/11

CPC classification number: H05K1/0219 ,  H01L23/49822 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/4046 ,  H05K3/4602 ,  H05K2201/096 ,  H05K2201/09809 ,  Y10T29/49155 ,  H01L2224/0401

Abstract: A multilayer wiring board capable of feeding sufficient electric power to a circuit element, such as an IC chip. In one embodiment of the present invention, a multilayer wiring board is comprised of: a core board; a build up layer disposed on an upper surface of the core board; a build up layer disposed on a lower surface of the core board; and a power supply structure embedded in a through hole penetrating the core board and the build up layers. The power supply structure is comprised of: a conductive metal rod made of copper as a main material; a conductive metal tube made of copper as a main material and provided coaxially with the conductive metal rod; and an insulating material filling a gap between the conductive metal rod and the conductive metal tube.

Abstract translation: 能够向诸如IC芯片的电路元件供给足够电力的多层布线板。 在本发明的一个实施例中，多层布线板包括：芯板; 设置在所述芯板的上表面上的堆积层; 设置在所述芯板的下表面上的堆积层; 以及嵌入贯穿核心板和构建层的通孔中的电源结构。 电源结构包括：以铜为主要材料的导电金属棒; 由铜作为主要材料制成并与导电金属棒同轴设置的导电金属管; 以及填充导电金属棒和导电金属管之间的间隙的绝缘材料。