公开(公告)号：US20170170040A1

公开(公告)日：2017-06-15

申请号：US15378595

申请日：2016-12-14

Applicant: Tokyo Electron Limited

Inventor： Kenichi SHIGETOMI ,  Takeshi SAIKUSA ,  Eiichi SEKIMOTO ,  Takayuki FUKUDOME ,  Kousuke YOSHIHARA ,  Suguru ENOKIDA ,  Kazuhiro TAKESHITA ,  Kazuto UMEKI

IPC: H01L21/67

CPC classification number: H01L21/67248 ,  H01L21/67103 ,  H05B1/0233 ,  H05B2203/037

Abstract: A substrate processing apparatus includes plural heating modules each including a table on which a substrate is placed to be heated, the substrate having plural heated zones. The table has plural heaters each assigned to heat respective ones of the heated zones. Heat generation of the heaters is controlled independently. A control unit controls the heaters such that integrated quantities of heat of the respective heated zones given by the corresponding heaters from first to second time point are substantially identical to each other in each of the heating modules, and are substantially identical to each other among the heating modules. The first time point is set when a temperature transition profile of the substrate is rising toward a process temperature after placing the substrate on the table under a condition where heat generation of the heaters is stable. The second time point is set after the temperature transition profile reaches the process temperature.

公开(公告)号：US20200041913A1

公开(公告)日：2020-02-06

申请号：US16521052

申请日：2019-07-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihisa KOGA ,  Yoshitaka KONISHI ,  Naruaki IIDA ,  Yuzo OHISHI ,  Kazuhiro TAKESHITA

IPC: G03F7/20 ,  H01L21/027

Abstract: There is provided a substrate processing apparatus including: a light radiator configured to radiate a light for processing into an irradiation area which is smaller than a processing target area of a surface of a substrate; a driver configured to move the irradiation area in two directions that cross each other in a plane along the surface of the substrate; and a controller configured to control the driver to move an irradiation position in two directions according to a movement pattern which has been set to radiate the light to an entire area of the processing target area.

公开(公告)号：US20170032983A1

公开(公告)日：2017-02-02

申请号：US15220653

申请日：2016-07-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Koshi MUTA ,  Tsuyoshi MORIYA ,  Takuya MORI ,  Kazuhiro TAKESHITA ,  Tomonori ESAKI ,  Kouichi MIZUNAGA ,  Masataka TANAKA ,  Kouzou KANAGAWA ,  Keigo NAKANO

IPC: H01L21/67 ,  G03F7/16

CPC classification number: G03F7/16 ,  G03F7/168 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67748

Abstract: A thermal catalytic layer is formed on the inner surface of a processing container and heated. Thus, when a sublimate sublimated from a coating film on a wafer W and received within the processing container reaches the vicinity of the thermal catalytic layer, the sublimate is decomposed and removed by the thermal activation of the thermal catalytic layer. In removing a sublimate attached to a light transmission window, a cleaning substrate formed with the thermal catalytic layer on the surface thereof is carried into the processing container and caused to approach the light transmission window. Thereafter, the cleaning substrate is heated so that the sublimate attached to the surface of the light transmission window is removed.

Abstract translation: 在处理容器的内表面上形成热催化剂层并加热。 因此，当从晶片W上的涂膜升华并接收在处理容器内的升华达到热催化层附近时，通过热催化层的热活化来分解和去除升华。 在移除附着在透光窗口上的升华中，在其表面上形成有热催化层的清洁基板被运送到处理容器中并使其接近透光窗。 此后，加热清洁基板，使得附着在透光窗的表面上的升华被去除。