公开(公告)号：US12098076B2

公开(公告)日：2024-09-24

申请号：US17425852

申请日：2020-02-13

Applicant: TOKUYAMA CORPORATION

Inventor： Keiji Saiki ,  Masayuki Numata ,  Teppei Ueno ,  Hiroo Aoki

IPC: C01B33/12 ,  C08K3/36 ,  C08L57/00 ,  C08L87/00

CPC classification number: C01B33/12 ,  C08K3/36 ,  C08L57/00 ,  C08L87/00 ,  C01P2004/51 ,  C01P2006/10 ,  C08K2201/005 ,  C08K2201/011

Abstract: Provided is silica powder that, when used as a resin filler such as a semiconductor sealant, allows for obtaining a resin composition having excellent gap permeability and low viscosity. The silica powder is such that (1) a cumulative 50% mass diameter D50 of a mass-based particle size distribution obtained by a centrifugal sedimentation method is 300 nm to 500 nm (preferably, 330 nm to 400 nm), (2) a loose bulk density is 250 kg/m3 to 400 kg/m3 (preferably, 270 kg/m3 to 350 kg/m3), and (3) {(D90−D50)/D50}×100 is 30% to 45%. In a silica production method in which a silicon compound is burned, silica powder can be produced by installing a burner having a concentric multiple pipe structure of three or more pipes in a reactor which has a cooling jacket portion provided around the burner, and adjusting flame combustion conditions and cooling conditions.