公开(公告)号：US20170135220A1

公开(公告)日：2017-05-11

申请号：US15330844

申请日：2016-11-07

Applicant: THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO

Inventor： Perumal Varun Chadalavada ,  Daniel Wigdor

IPC: H05K3/02 ,  H05K1/09

CPC classification number: H05K3/027 ,  H05K1/0386 ,  H05K1/092 ,  H05K3/04 ,  H05K3/048 ,  H05K3/06 ,  H05K2201/0108 ,  H05K2201/032 ,  H05K2201/0335 ,  H05K2201/0355 ,  H05K2203/013 ,  H05K2203/0264 ,  H05K2203/0525 ,  H05K2203/0551 ,  H05K2203/068

Abstract: Film for use in preparing a printed circuit board (PCB) along with methods for making a PCB and producing a printable film are described herein. The film includes a first layer formed of a radiation-transparent material, a second layer formed of a curable adhesive material, a third layer formed of an electrically conductive material, and optionally, a fourth layer formed of an adhesive and a fifth layer formed of a removable material. Through the adhesive layers, the layers are bonded together to produce the printable film. To produce a PCB, the first layer is covered in ink distributed in a pattern representing the PCB, and the ink-covered film is exposed to radiation until the non-ink-covered portions of the second layer have cured. Then, the fifth layer is removed tearing away the electrically conductive material associated with the non-ink-covered portions of the second layer producing the PCB.