公开(公告)号：US20180001418A1

公开(公告)日：2018-01-04

申请号：US15199896

申请日：2016-06-30

Applicant: THE BOEING COMPANY

Inventor： Nick S. EVANS ,  Bradley J. MITCHELL ,  Mark BLUMENKRANTZ

IPC: B23K26/02 ,  B23K26/364 ,  B23K26/351 ,  B23K101/32 ,  B23K101/38

CPC classification number: B23K26/364 ,  B23K26/0604 ,  B23K26/0823 ,  B23K26/1224 ,  B23K26/123 ,  B23K26/127 ,  B23K26/38 ,  B23K2101/32 ,  B23K2101/34 ,  B23K2101/38

Abstract: A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.