公开(公告)号：US20230138570A1

公开(公告)日：2023-05-04

申请号：US17515295

申请日：2021-10-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Thomas Dyer BONIFIELD ,  Sarvesh Jagdish BANG ,  Chittranjan Mohan GUPTA

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/00 ,  H01L25/18 ,  H01L25/065

Abstract: In examples, a semiconductor package comprises a first driver die adapted to be coupled to a high-side switch of a power supply, the first driver die adapted to drive a gate of the high-side switch. The package also includes a second driver die adapted to be coupled to a low-side switch of the power supply, the second driver die adapted to drive a gate of the low-side switch. The package also includes a controller die positioned between the first and second driver dies and configured to control the first and second driver dies. The package also includes a pair of bond wires configured to provide a differential signal between the controller die and the first driver die, a vertical plane of a bond wire in the pair of bond wires and a vertical plane of a side surface of the first driver die having an angle therebetween ranging from 80 to 95 degrees.