公开(公告)号：US20240413114A1

公开(公告)日：2024-12-12

申请号：US18810928

申请日：2024-08-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Christopher Daniel MANACK ,  Salvatore Frank PAVONE ,  Maricel Fabia ESCAÑO ,  Rafael Jose Lizares GUEVARA

IPC: H01L23/00

Abstract: In examples, a semiconductor package comprises a semiconductor die having an active surface; a conductive layer coupled to the active surface; and a polyimide layer coupled to the conductive layer. The package also comprises a conductive pillar coupled to the conductive layer and to the polyimide layer; a flux adhesive material coupled to the conductive pillar; and a solder layer coupled to the flux adhesive material. The package further includes a conductive terminal coupled to the solder layer and exposed to a surface of the package, the active surface of the semiconductor die facing the conductive terminal.

公开(公告)号：US20190109109A1

公开(公告)日：2019-04-11

申请号：US16038598

申请日：2018-07-18

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Nazila DADVAND ,  Christopher Daniel MANACK ,  Salvatore Frank PAVONE

IPC: H01L23/00

Abstract: A structure for a semiconductor device includes a copper (Cu) layer and a first nickel (Ni) alloy layer with a Ni grain size a1. The structure also includes a second Ni alloy layer with a Ni grain size a2, wherein a1

公开(公告)号：US20210134750A1

公开(公告)日：2021-05-06

申请号：US16669070

申请日：2019-10-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Christopher Daniel MANACK ,  Salvatore Frank PAVONE ,  Maricel Fabia ESCAÑO ,  Rafael Jose Lizares GUEVARA

IPC: H01L23/00

Abstract: In examples, a semiconductor package comprises a semiconductor die having an active surface; a conductive layer coupled to the active surface; and a polyimide layer coupled to the conductive layer. The package also comprises a conductive pillar coupled to the conductive layer and to the polyimide layer; a flux adhesive material coupled to the conductive pillar; and a solder layer coupled to the flux adhesive material. The package further includes a conductive terminal coupled to the solder layer and exposed to a surface of the package, the active surface of the semiconductor die facing the conductive terminal.

公开(公告)号：US20200321299A1

公开(公告)日：2020-10-08

申请号：US16909649

申请日：2020-06-23

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Nazila DADVAND ,  Christopher Daniel MANACK ,  Salvatore Frank PAVONE

IPC: H01L23/00

Abstract: A structure for a semiconductor device includes a copper (Cu) layer and a first nickel (Ni) alloy layer with a Ni grain size a1. The structure also includes a second Ni alloy layer with a Ni grain size a2, wherein a1

公开(公告)号：US20230065075A1

公开(公告)日：2023-03-02

申请号：US17463047

申请日：2021-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Qiao CHEN ,  Vivek Swaminathan SRIDHARAN ,  Christopher Daniel MANACK ,  Patrick Francis THOMPSON ,  Jonathan Andrew MONTOYA ,  Salvatore Frank PAVONE

IPC: H01L23/00

Abstract: In some examples a wafer chip scale package (WCSP) includes a semiconductor die having a device side in which a circuit is formed, and a redistribution layer (RDL) coupled to the device side that is positioned within an insulating member. In addition, the WCSP includes a scribe seal circumscribing the circuit along the device side, wherein the RDL abuts the scribe seal. Further, the WCSP includes a conductive member coupled to the RDL. The conductive member is configured to receive a solder member, and the insulating member does not extend along the device side of the semiconductor die between the conductive member and a portion of an outer perimeter of the WCSP closest to the conductive member.

公开(公告)号：US20220173062A1

公开(公告)日：2022-06-02

申请号：US17672463

申请日：2022-02-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Nazila DADVAND ,  Christopher Daniel MANACK ,  Salvatore Frank PAVONE

IPC: H01L23/00

Abstract: A structure for a semiconductor device includes a copper (Cu) layer and a first nickel (Ni) alloy layer with a Ni grain size a1. The structure also includes a second Ni alloy layer with a Ni grain size a2, wherein a1

公开(公告)号：US20210193600A1

公开(公告)日：2021-06-24

申请号：US16721546

申请日：2019-12-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Vivek Swaminathan SRIDHARAN ,  Christopher Daniel MANACK ,  Nazila DADVAND ,  Salvatore Frank PAVONE ,  Patrick Francis THOMPSON

IPC: H01L23/00

Abstract: In some examples, a package comprises a die and a redistribution layer coupled to the die. The redistribution layer comprises a metal layer, a brass layer abutting the metal layer, and a polymer layer abutting the brass layer.