公开(公告)号：US20140179064A1

公开(公告)日：2014-06-26

申请号：US14189404

申请日：2014-02-25

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Matthew D. Romig ,  Marie-Solange Milleron

IPC: H01L21/56 ,  H01L23/00

CPC classification number: H01L21/561 ,  B81C1/0023 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/95 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/00014

Abstract: A method for fabricating a semiconductor system starts with providing a first component including a first semiconductor chip attached to a pad of a first metal leadframe made of a first metal sheet of high thermal conductivity. A second component including a second semiconductor chip attached to a pad of a second metal leadframe made of a second metal sheet wire-bondable on both surfaces is provided. The second component is encapsulated in a polymeric housing leaving un-encapsulated the lead surfaces facing away from the second chip. The polymeric housing of the second component is attached to the first chip using a layer of low thermal conductivity, whereby the un-encapsulated lead surfaces face away from the first chip. Bonding wires are connected to the un-encapsulated surfaces of the second component leads to the leads of the first component.

Abstract translation: 一种制造半导体系统的方法从提供第一部件开始，该第一部件包括第一半导体芯片，该第一部件附着到由高导热性的第一金属片制成的第一金属引线框的焊盘上。 提供第二部件，其包括附接到第二金属引线框的焊盘的第二半导体芯片，所述第二金属引线框由在两个表面上可焊接的第二金属片制成。 第二部件被封装在聚合物壳体中，从而未引导表面背离第二芯片。 第二部件的聚合物壳体使用低导热性层附接到第一芯片，由此未封装的引线表面远离第一芯片。 接合线连接到第二部件的未封装的表面通向第一部件的引线。