公开(公告)号：US20240329164A1

公开(公告)日：2024-10-03

申请号：US18193099

申请日：2023-03-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dok Won Lee ,  Keith Ryan Green ,  Fanping Sui ,  Charles Parkhurst

IPC: G01R33/07 ,  G01R33/00 ,  H10N52/01 ,  H10N52/80

CPC classification number: G01R33/077 ,  G01R33/0011 ,  H10N52/01 ,  H10N52/80

Abstract: The present disclosure generally relates to magnetic field sensors with magnetic flux concentrators, and more particularly, to Hall sensors (which may be vertical or in-plane field Hall sensors) with magnetic flux concentrators. In an example, a sensor device includes a semiconductor die, a first magnetic flux concentrator, and a second magnetic flux concentrator. The semiconductor die includes a semiconductor substrate and an interconnect structure. The semiconductor substrate includes a Hall sensor in a semiconductor material. The interconnect structure is over the semiconductor substrate. The first magnetic flux concentrator is over the semiconductor die. The second magnetic flux concentrator is over the semiconductor die. At least part of the Hall sensor is laterally between the first magnetic flux concentrator and the second magnetic flux concentrator.