公开(公告)号：US11227852B2

公开(公告)日：2022-01-18

申请号：US16854823

申请日：2020-04-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Honglin Guo ,  Jason Chien ,  Byron Lovell Williams ,  Jeffrey Alan West ,  Anderson Li ,  Arvin Nono Verdeflor

IPC: H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L23/495 ,  H01L23/31 ,  H01L25/065

Abstract: An integrated circuit and methods for packaging the integrated circuit. In one example, a method for packaging an integrated circuit includes connecting input/output pads of a first integrated circuit die to terminals of a lead frame via palladium coated copper wires. An oxygen plasma is applied to the first integrated circuit die and the palladium coated copper wires. The first integrated circuit die and the palladium coated copper wires are encapsulated in a mold compound after application of the oxygen plasma.

公开(公告)号：US12021004B2

公开(公告)日：2024-06-25

申请号：US17510684

申请日：2021-10-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hiep Xuan Nguyen ,  Jaimal Mallory Wiliamson ,  Arvin Nono Verdeflor ,  Snehamay Sinha

IPC: H01L23/367 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/3675 ,  H01L21/4817 ,  H01L21/565 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16237 ,  H01L2224/32245 ,  H01L2924/1616 ,  H01L2924/16251 ,  H01L2924/16724

Abstract: An electronic device includes a multilevel package substrate, a die, a lid, and a package structure that encloses the die, a portion of the lid, and a portion of the multilevel package substrate, where the package structure fills a gap between a side of another portion of the lid and a side of the die. A method includes attaching a die to a multilevel package substrate with a first side of the die facing the multilevel package substrate and a second side facing away from the multilevel package substrate; positioning a lid on the multilevel package substrate with a first portion of the lid spaced apart from the second side of the die; and forming a package structure that encloses the die and a portion of the multilevel package substrate and fills a gap between the first portion of the lid and the second side of the die.

公开(公告)号：US20220319950A1

公开(公告)日：2022-10-06

申请号：US17510684

申请日：2021-10-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hiep Xuan Nguyen ,  Jaimal Mallory Wiliamson ,  Arvin Nono Verdeflor ,  Snehamay Sinha

IPC: H01L23/367 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic device includes a multilevel package substrate, a die, a lid, and a package structure that encloses the die, a portion of the lid, and a portion of the multilevel package substrate, where the package structure fills a gap between a side of another portion of the lid and a side of the die. A method includes attaching a die to a multilevel package substrate with a first side of the die facing the multilevel package substrate and a second side facing away from the multilevel package substrate; positioning a lid on the multilevel package substrate with a first portion of the lid spaced apart from the second side of the die; and forming a package structure that encloses the die and a portion of the multilevel package substrate and fills a gap between the first portion of the lid and the second side of the die.