公开(公告)号：US20240178023A1

公开(公告)日：2024-05-30

申请号：US18519091

申请日：2023-11-27

Applicant: TES CO., LTD

Inventor： Jong-Seok LEE ,  Seung-Min OH ,  In-Il JUNG

IPC: H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67253 ,  H01L21/6704 ,  H01L22/26

Abstract: Provided is a substrate processing apparatus, more particularly, a substrate processing apparatus for detecting a progress and end point of a process for a substrate when a process such as a drying process is performed for a substrate using a supercritical fluid.

公开(公告)号：US20240186159A1

公开(公告)日：2024-06-06

申请号：US18525785

申请日：2023-11-30

Applicant: TES CO., LTD

Inventor： Jong-Seok LEE ,  Seung-Min OH ,  In-Il JUNG

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67207 ,  H01L21/6704 ,  H01L21/67248 ,  H01L21/68742 ,  H01L21/68785

Abstract: Provided is a substrate processing apparatus including a chamber providing a processing space in which a process is performed on a substrate coated with an organic solvent using a fluid in a supercritical state, a tray unit supporting the substrate and provided to be inserted into the chamber and withdraw from the chamber through an opening of the chamber, and a detector configured to measure a resistance of the substrate.

公开(公告)号：US20250001467A1

公开(公告)日：2025-01-02

申请号：US18747466

申请日：2024-06-19

Applicant: TES CO., LTD

Inventor： In-Il JUNG ,  Seung-Min OH ,  Jong-Seok LEE

IPC: B08B7/00 ,  B08B7/02 ,  H01L21/02

Abstract: The present disclosure relates to a substrate processing method, and more particularly, to a substrate processing method of a substrate processing device using a supercritical fluid, to reduce damage or defects to a substrate when the supercritical fluid is supplied into the chamber.