SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20250051919A1

    公开(公告)日:2025-02-13

    申请号:US18796269

    申请日:2024-08-06

    Applicant: TES CO., LTD

    Abstract: The present disclosure relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a substrate processing apparatus and a substrate processing method for accurately accommodating a substrate at a central portion of a susceptor even when a tilt angle or a tilt direction of the susceptor on which the substrate is accommodated changes for each substrate or for each substrate process.

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