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公开(公告)号:US20220099231A1
公开(公告)日:2022-03-31
申请号:US17427219
申请日:2020-02-06
发明人: Adrian GARCIA , Adam THISTLETHWAITE , Matthew GUEST , Andrew CAMPBELL , Daniel CHALUPSKY , Mark Lee SWAIN , Matthew YASENSKY
IPC分类号: F16L55/175 , F16L55/179
摘要: A modular enclosure system and method for repair of one or more leaks in a pipe. The modular enclosure system including a first enclosure portion configured to be disposed in a mated configuration to create a first enclosure around the pipe. Each enclosure includes a first void section configured to enclose a pipe section of the pipe. Sealant grooves extend along enclosure faces of each enclosure to seal the modular enclosure system. Each enclosure includes a sealant control system having a plurality of blocking members and configured to selectively block sealant injected in the sealant grooves. Each of the blocking members are positionable between a blocking position configured to block sealant flow in at least one of the sealant grooves and a non-blocking position.