MODULAR LEAK REPAIR
    1.
    发明申请

    公开(公告)号:US20220099231A1

    公开(公告)日:2022-03-31

    申请号:US17427219

    申请日:2020-02-06

    IPC分类号: F16L55/175 F16L55/179

    摘要: A modular enclosure system and method for repair of one or more leaks in a pipe. The modular enclosure system including a first enclosure portion configured to be disposed in a mated configuration to create a first enclosure around the pipe. Each enclosure includes a first void section configured to enclose a pipe section of the pipe. Sealant grooves extend along enclosure faces of each enclosure to seal the modular enclosure system. Each enclosure includes a sealant control system having a plurality of blocking members and configured to selectively block sealant injected in the sealant grooves. Each of the blocking members are positionable between a blocking position configured to block sealant flow in at least one of the sealant grooves and a non-blocking position.