公开(公告)号：US10855108B2

公开(公告)日：2020-12-01

申请号：US16198032

申请日：2018-11-21

Applicant: TDK TAIWAN CORP.

Inventor： Feng-Lung Chien ,  Mao-Chun Chen ,  Hsiang-Hui Hsu ,  Kuo-Jui Lee ,  Chien-Hung Lin

IPC: H02J50/00 ,  H01F38/14 ,  H02J7/02 ,  H02J50/10 ,  H04B5/00 ,  H01F27/29 ,  H01F27/28 ,  H01F27/30

Abstract: A wireless device is provided and includes a coil assembly. The coil assembly includes a first coil, a second coil, a first contact, a second contact, and a third contact. The second coil is configured to be connected to the first coil in series. The first contact is configured to be connected to a first end of the first coil. The second contact is configured to be connected between the first coil and the second coil. The third contact is configured to be connected to a second end of the second coil. The first contact, the first coil and the second contact form a first circuit loop, and the first contact, the first coil, the second coil and the third contact form a second circuit loop.

公开(公告)号：US12224108B2

公开(公告)日：2025-02-11

申请号：US18481530

申请日：2023-10-05

Applicant: TDK TAIWAN CORP.

Inventor： Feng-Lung Chien ,  Tsang-Feng Wu ,  Yuan Han ,  Tzu-Chieh Kao ,  Chien-Hung Lin ,  Kuang-Lun Lee ,  Hsiang-Hui Hsu ,  Shu-Yi Tsui ,  Kuo-Jui Lee ,  Kun-Ying Lee ,  Mao-Chun Chen ,  Tai-Hsien Yu ,  Wei-Yu Chen ,  Yi-Ju Li ,  Kuei-Yuan Chang ,  Wei-Chun Li ,  Ni-Ni Lai ,  Sheng-Hao Luo ,  Heng-Sheng Peng ,  Yueh-Hui Kuan ,  Hsiu-Chen Lin ,  Yan-Bing Zhou ,  Chris T. Burket

IPC: H01F27/28 ,  H01F27/32 ,  H02J7/02 ,  H02J50/10 ,  H04B5/79

Abstract: A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.

公开(公告)号：US11817253B2

公开(公告)日：2023-11-14

申请号：US16862902

申请日：2020-04-30

Applicant: TDK TAIWAN CORP.

Inventor： Feng-Lung Chien ,  Tsang-Feng Wu ,  Yuan Han ,  Tzu-Chieh Kao ,  Chien-Hung Lin ,  Kuang-Lun Lee ,  Hsiang-Hui Hsu ,  Shu-Yi Tsui ,  Kuo-Jui Lee ,  Kun-Ying Lee ,  Mao-Chun Chen ,  Tai-Hsien Yu ,  Wei-Yu Chen ,  Yi-Ju Li ,  Kuei-Yuan Chang ,  Wei-Chun Li ,  Ni-Ni Lai ,  Sheng-Hao Luo ,  Heng-Sheng Peng ,  Yueh-Hui Kuan ,  Hsiu-Chen Lin ,  Yan-Bing Zhou ,  Chris T. Burket

IPC: H01F27/28 ,  H01F27/32 ,  H02J50/10 ,  H02J7/02 ,  H04B5/00

CPC classification number: H01F27/2871 ,  H01F27/28 ,  H01F27/288 ,  H01F27/2876 ,  H01F27/32 ,  H02J7/02 ,  H02J50/10 ,  H04B5/0037

Abstract: A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.