公开(公告)号：US11817253B2

公开(公告)日：2023-11-14

申请号：US16862902

申请日：2020-04-30

申请人： TDK TAIWAN CORP.

发明人： Feng-Lung Chien ,  Tsang-Feng Wu ,  Yuan Han ,  Tzu-Chieh Kao ,  Chien-Hung Lin ,  Kuang-Lun Lee ,  Hsiang-Hui Hsu ,  Shu-Yi Tsui ,  Kuo-Jui Lee ,  Kun-Ying Lee ,  Mao-Chun Chen ,  Tai-Hsien Yu ,  Wei-Yu Chen ,  Yi-Ju Li ,  Kuei-Yuan Chang ,  Wei-Chun Li ,  Ni-Ni Lai ,  Sheng-Hao Luo ,  Heng-Sheng Peng ,  Yueh-Hui Kuan ,  Hsiu-Chen Lin ,  Yan-Bing Zhou ,  Chris T. Burket

IPC分类号： H01F27/28 ,  H01F27/32 ,  H02J50/10 ,  H02J7/02 ,  H04B5/00

CPC分类号： H01F27/2871 ,  H01F27/28 ,  H01F27/288 ,  H01F27/2876 ,  H01F27/32 ,  H02J7/02 ,  H02J50/10 ,  H04B5/0037

摘要： A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.