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公开(公告)号:US11894177B2
公开(公告)日:2024-02-06
申请号:US18119473
申请日:2023-03-09
申请人: TDK CORPORATION
发明人: Takahiro Kawahara , Manabu Ohta , Kenei Onuma , Yuuya Kaname , Ryo Fukuoka , Hokuto Eda , Masataro Saito , Kohei Takahashi
CPC分类号: H01F27/292 , H01F17/0013 , H01F17/04 , H01F27/2804 , H01F41/041 , H05K1/181 , H01F2017/048
摘要: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
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公开(公告)号:US08975997B2
公开(公告)日:2015-03-10
申请号:US13847079
申请日:2013-03-19
申请人: TDK Corporation
发明人: Kyohei Tonoyama , Makoto Morita , Tomokazu Ito , Hitoshi Ohkubo , Manabu Ohta , Yoshihiro Maeda , Yuuya Kaname , Hideharu Moro
CPC分类号: H01F27/255 , H01F17/0013 , H01F27/292 , H01F2017/048
摘要: In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. 9A and has improved magnetic permeability as compared to a planar coil element shown in FIG. 9B.
摘要翻译: 在平面线圈元件中,设置在线圈单元的通孔中的含金属磁性粉末的树脂中包含的第一金属磁粉的倾斜粒子与总粒子的定量比高于倾斜粒子与总体的定量比 除了通孔以外的金属磁性粉末的树脂中含有的第一金属磁性粉末的颗粒,磁芯中的第一金属磁性粉末的许多颗粒是倾斜的,其长轴相对于 厚度方向和基板的平面方向。 因此,与图1所示的平面线圈元件相比,平面线圈元件具有改善的强度。 与图9A所示的平面线圈元件相比,磁导率提高。 9B。
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公开(公告)号:US11557427B2
公开(公告)日:2023-01-17
申请号:US16733293
申请日:2020-01-03
申请人: TDK CORPORATION
发明人: Hitoshi Ohkubo , Masazumi Arata , Manabu Ohta , Yuuya Kaname , Yoshihiro Maeda , Takahiro Kawahara , Hokuto Eda , Shigeki Sato
摘要: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.
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公开(公告)号:US10559417B2
公开(公告)日:2020-02-11
申请号:US15166519
申请日:2016-05-27
申请人: TDK CORPORATION
发明人: Hitoshi Ohkubo , Masazumi Arata , Manabu Ohta , Yuuya Kaname , Yoshihiro Maeda , Takahiro Kawahara , Hokuto Eda , Shigeki Sato
摘要: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.
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公开(公告)号:US11631529B2
公开(公告)日:2023-04-18
申请号:US16811610
申请日:2020-03-06
申请人: TDK CORPORATION
发明人: Takahiro Kawahara , Manabu Ohta , Kenei Onuma , Yuuya Kaname , Ryo Fukuoka , Hokuto Eda , Masataro Saito , Kohei Takahashi
摘要: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
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公开(公告)号:US09349522B2
公开(公告)日:2016-05-24
申请号:US14831761
申请日:2015-08-20
申请人: TDK Corporation
发明人: Hitoshi Ohkubo , Tomokazu Ito , Hideto Itoh , Yoshihiro Maeda , Manabu Ohta , Yuuya Kaname , Takahiro Kawahara , Takashi Nakagawa
CPC分类号: H01F27/2804 , H01F17/0033 , H01F27/022 , H01F27/255 , H01F27/29 , H01F27/292 , H01F2017/0073 , H01F2027/2809
摘要: A coil component includes a substrate, a planar spiral conductor formed on a top surface of the substrate, a lead conductor connected to an outer peripheral end of the planar spiral conductor, a dummy lead conductor formed on the top surface of the substrate between an outermost turn of the planar spiral conductor and an end of the substrate and free from an electrical connection with another conductor within the same plane, external electrodes and arranged in parallel with the top surface of the substrate, and a bump electrode formed on a surface of the lead conductor and connects the lead conductor with the external electrode. The external terminals have a larger area than the bump electrodes for securing a bonding strength.
摘要翻译: 线圈部件包括基板,形成在基板的上表面的平面螺旋导体,与平面螺旋导体的外周端连接的引线导体,形成在基板的上表面之间的最外侧 平面螺旋导体和基板的端部的转动,并且与同一平面内的另一个导体和外部电极的电连接没有电连接,并且与基板的顶表面平行布置,并且凸起电极形成在基板的表面上 引线导体,并将引线导体与外部电极连接。 外部端子具有比用于确保接合强度的凸块电极更大的面积。
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7.
公开(公告)号:US20140077914A1
公开(公告)日:2014-03-20
申请号:US14018293
申请日:2013-09-04
申请人: TDK Corporation
发明人: Hitoshi Ohkubo , Kyohei Tonoyama , Makoto Morita , Tomokazu Ito , Hideto Itoh , Yoshihiro Maeda , Manabu Ohta , Yuuya Kaname , Takahiro Kawahara
CPC分类号: H01F5/00 , H01F1/06 , H01F1/26 , H01F27/255 , H01F27/2804 , H01F27/292 , H01F2017/0066 , H01F2027/2809
摘要: A coil component 1 is provided with coil conductors 10a and 10b and a magnetic metal powder containing resin 22 (22a and 22b) covering the coil conductors 10a and 10b. The magnetic metal powder containing resin 22 includes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 μm or more and 100 μm or less. The third average grain diameter is 2 μm or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.
摘要翻译: 线圈部件1设置有线圈导体10a,10b和覆盖线圈导体10a,10b的含有树脂22(22a,22b)的磁性金属粉末。 含有磁性金属粉末的树脂22包括具有第一平均粒径的第一金属粉末,具有小于第一平均粒径的第二平均粒径的第二金属粉末和具有比第一平均粒径小的第三平均粒径的第三金属粉末 比第二平均粒径。 第一平均粒径为15μm以上且100μm以下。 第三平均粒径为2μm以下。 第一种金属粉末主要含有坡莫合金,第二和第三种金属粉末主要含有羰基铁。
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公开(公告)号:US11810708B2
公开(公告)日:2023-11-07
申请号:US18119457
申请日:2023-03-09
申请人: TDK CORPORATION
发明人: Takahiro Kawahara , Manabu Ohta , Kenei Onuma , Yuuya Kaname , Ryo Fukuoka , Hokuto Eda , Masataro Saito , Kohei Takahashi
CPC分类号: H01F27/292 , H01F17/0013 , H01F17/04 , H01F27/2804 , H01F41/041 , H05K1/181 , H01F2017/048
摘要: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
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公开(公告)号:US10147540B2
公开(公告)日:2018-12-04
申请号:US13848441
申请日:2013-03-21
申请人: TDK CORPORATION
发明人: Kyohei Tonoyama , Makoto Morita , Tomokazu Ito , Hitoshi Ohkubo , Manabu Ohta , Yoshihiro Maeda , Yuuya Kaname , Hideharu Moro
摘要: In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 μm) smaller than that (32 μm) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element.
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10.
公开(公告)号:US09406420B2
公开(公告)日:2016-08-02
申请号:US14018293
申请日:2013-09-04
申请人: TDK Corporation
发明人: Hitoshi Ohkubo , Kyohei Tonoyama , Makoto Morita , Tomokazu Ito , Hideto Itoh , Yoshihiro Maeda , Manabu Ohta , Yuuya Kaname , Takahiro Kawahara
IPC分类号: H01F17/00 , H01F1/00 , B32B15/00 , G11B5/708 , H01F5/00 , H01F1/06 , H01F1/26 , H01F27/255 , H01F27/28 , H01F27/29
CPC分类号: H01F5/00 , H01F1/06 , H01F1/26 , H01F27/255 , H01F27/2804 , H01F27/292 , H01F2017/0066 , H01F2027/2809
摘要: A coil component 1 is provided with coil conductors 10a and 10b and a magnetic metal powder containing resin 22 (22a and 22b) covering the coil conductors 10a and 10b. The magnetic metal powder containing resin 22 includes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 μm or more and 100 μm or less. The third average grain diameter is 2 μm or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.
摘要翻译: 线圈部件1设置有线圈导体10a,10b和覆盖线圈导体10a,10b的含有树脂22(22a,22b)的磁性金属粉末。 含有磁性金属粉末的树脂22包括具有第一平均粒径的第一金属粉末,具有小于第一平均粒径的第二平均粒径的第二金属粉末和具有比第一平均粒径小的第三平均粒径的第三金属粉末 比第二平均粒径。 第一平均粒径为15μm以上且100μm以下。 第三平均粒径为2μm以下。 第一种金属粉末主要含有坡莫合金,第二和第三种金属粉末主要含有羰基铁。
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