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公开(公告)号:US11722117B2
公开(公告)日:2023-08-08
申请号:US17102835
申请日:2020-11-24
发明人: Ryohei Komiyama
CPC分类号: H03H9/02574 , H03H3/04 , H03H9/02559 , H03H9/02834 , H03H9/725 , H10N30/87 , H03H2003/0407
摘要: An acoustic wave resonator includes a support substrate, a piezoelectric layer that is disposed on the support substrate and is a rotated Y-cut X-propagation lithium tantalate of which a cut angle is within a range of greater than 50° and less than 150°, and a pair of comb-shaped electrodes disposed on the piezoelectric layer, each of the comb-shaped electrodes including a plurality of electrode fingers, an average pitch of the electrode fingers of one of the comb-shaped electrodes being equal to or greater than ½ of a thickness of the piezoelectric layer.
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公开(公告)号:US10938372B2
公开(公告)日:2021-03-02
申请号:US16390739
申请日:2019-04-22
IPC分类号: H03H9/02 , H03H3/10 , H03H9/145 , H03H9/64 , H03H9/72 , B23K26/53 , B23K26/00 , H03H9/25 , H01L41/338 , H01L41/312
摘要: An acoustic wave resonator includes: a piezoelectric substrate; a pair of comb-shaped electrodes that is located on the piezoelectric substrate and excites an acoustic wave, each of the pair of comb-shaped electrodes including a plurality of electrode fingers; and a polycrystalline substrate that is located at an opposite side of the piezoelectric substrate from a surface on which the pair of comb-shaped electrodes is located, an average particle size of the polycrystalline substrate being equal to or less than 66 times an average pitch of the plurality of electrode fingers.
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公开(公告)号:US11336259B2
公开(公告)日:2022-05-17
申请号:US16802071
申请日:2020-02-26
摘要: An acoustic wave device includes: a piezoelectric substrate: a pair of comb-shaped electrodes located on the piezoelectric substrate, each of the comb-shaped electrodes including a plurality of electrode fingers; a support substrate having protruding portions and/or recessed portions in a region overlapping with the pair of comb-shaped electrodes in plan view, the protruding portions and/or recessed portions being regularly arranged; and an insulating layer directly or indirectly bonded between the piezoelectric substrate and the support substrate, a boundary face between the insulating layer and the support substrate being provided along the protruding portions and/or the recessed portions.
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