公开(公告)号：US20200279828A1

公开(公告)日：2020-09-03

申请号：US16753758

申请日：2018-10-02

Applicant: Synaptics Incorporated

Inventor： Kazuhiro Okamura ,  Takeshi Okubo ,  Yuichi Nakagomi ,  Takefumi Senou

IPC: H01L23/00

Abstract: An integrated circuit device comprises: a resin film that is flexible; a plurality of traces bonded on a surface of the resin film and arrayed in a specific direction; an IC chip bonded on the surface of the resin film, located offset to the traces in a direction perpendicular to the specific direction, and connected to the traces; and a protection pattern formed on the surface of the resin film, located in the specific direction with respect to a disposition region in which the IC chip and/or the traces are disposed, and formed of the same material as that of the traces.