Special-figure design ribbon for connecting back contact cells

    公开(公告)号:US11611007B1

    公开(公告)日:2023-03-21

    申请号:US17841628

    申请日:2022-06-15

    IPC分类号: H01L31/05

    摘要: A special-figure design ribbon for connecting back contact cells includes a body, a plurality of first solder joints, and a plurality of second solder joints. The plurality of first solder joints and the plurality of second solder joints are respectively located on two sides of the body in a width direction. Each of the first solder joints stretches outward from a first side of the body. Each of the second solder joints stretches outward from a second side of the body. A shape of each first solder joint is different from a shape of each second solder joint. Center lines of at least one set of the first solder joint and the second solder joint adjacent to each other are staggered from each other in the width direction of the body.

    Method for soldering solar cell, cell string, photovoltaic module, and soldering device

    公开(公告)号:US12074246B2

    公开(公告)日:2024-08-27

    申请号:US18216633

    申请日:2023-06-30

    摘要: A method for soldering a solar cell, includes: placing a plurality of back contact cells on a soldering platform, where back surfaces of the back contact cells face away from the soldering platform, and electrodes corresponding to two adjacent back contact cells have opposite polarities in a connection direction of a plurality of to-be-connected ribbons; placing the plurality of to-be-connected ribbons on the electrodes of the plurality of back contact cells by using a first clamping portion, a second clamping portion, and a plurality of third clamping portions, where the first clamping portion, the second clamping portion, and the plurality of third clamping portions respectively correspond to head ends, tail ends, and middle portions of the plurality of ribbons; and heating the plurality of ribbons by using a heater to connect the plurality of ribbons to the plurality of back contact cells.

    Back contact structure and selective contact region buried solar cell comprising the same

    公开(公告)号:US11777045B2

    公开(公告)日:2023-10-03

    申请号:US17541332

    申请日:2021-12-03

    IPC分类号: H01L31/05 H01L31/068

    CPC分类号: H01L31/0516 H01L31/068

    摘要: A back contact structure includes: a silicon substrate including a back surface including a plurality of recesses disposed at intervals; a first dielectric layer disposed on the back surface of the silicon substrate; a plurality of first doped regions disposed on the first dielectric layer and disposed inside the plurality of recesses; a plurality of second doped regions disposed on the first dielectric layer and disposed outside the plurality of recesses; a second dielectric layer disposed between the first doped regions and the second doped regions; and a conductive layer disposed on the first plurality of doped regions and the plurality of second doped regions.

    Electrode structure of back contact cell, back contact cell, back contact cell module, and back contact cell system

    公开(公告)号:US11588060B1

    公开(公告)日:2023-02-21

    申请号:US17743492

    申请日:2022-05-13

    IPC分类号: H01L31/0224 H01L31/02

    摘要: The disclosure provides an electrode structure of a back contact cell, a back contact cell, a back contact cell module, and a back contact cell system. The electrode structure includes: first fingers, configured to collect a first polarity region; second fingers, configured to collect a second polarity region; a first busbar, disposed on a side of the back contact cell close to a first edge and connected to the first fingers; first pad points; and first connection electrodes, respectively connected to the first busbar and the first pad points. A distance between each of the first pad points and the first edge is greater than a distance between the first busbar and the first edge. The electrode structure can improve the reliability, reduce the costs, increase the product yield, and ensure excellent photoelectric conversion efficiency.

    Method for soldering solar cell, cell string, photovoltaic module, and soldering device

    公开(公告)号:US11728454B1

    公开(公告)日:2023-08-15

    申请号:US17845962

    申请日:2022-06-21

    摘要: A method for soldering a solar cell, includes: placing a plurality of back contact cells on a soldering platform, where back surfaces of the back contact cells face away from the soldering platform, and electrodes corresponding to two adjacent back contact cells have opposite polarities in a connection direction of a plurality of to-be-connected ribbons; placing the plurality of to-be-connected ribbons on the electrodes of the plurality of back contact cells by using a first clamping portion, a second clamping portion, and a plurality of third clamping portions, where the first clamping portion, the second clamping portion, and the plurality of third clamping portions respectively correspond to head ends, tail ends, and middle portions of the plurality of ribbons; and heating the plurality of ribbons by using a heater to connect the plurality of ribbons to the plurality of back contact cells.

    Passivated contact structure and solar cell comprising the same, cell assembly, and photovoltaic system

    公开(公告)号:US11489080B1

    公开(公告)日:2022-11-01

    申请号:US17509060

    申请日:2021-10-24

    IPC分类号: H01L31/0216 H01L31/0236

    摘要: The disclosure provides a passivated contact structure and a solar cell including the same, a cell assembly and a photovoltaic system. The passivated contact structure includes a first passivated contact region on a silicon substrate and a second passivated contact region on the first passivated contact region. The second passivated contact region has an opening connecting a conductive layer to the first passivated contact region. The first passivated contact region includes a first doped layer, a first passivation layer and a second doped layer. The second passivated contact region includes a second passivation layer and a third doped layer. The first passivation layer is a porous structure inlaid with the first doped layer and/or the second doped layer in a hole region. Utilizing the passivated contact structure provided in this invention, mitigates the serious recombination caused by metal directly contacting with silicon substrate.