公开(公告)号：US11784622B2

公开(公告)日：2023-10-10

申请号：US16555901

申请日：2019-08-29

申请人： Skyworks Solutions, Inc.

发明人： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC分类号： H03H3/08 ,  H03H9/02 ,  B23K26/362 ,  H03H9/10 ,  H03H9/25 ,  H03H9/05

CPC分类号： H03H3/08 ,  B23K26/362 ,  H03H9/02559 ,  H03H9/02622 ,  H03H9/059 ,  H03H9/1064 ,  H03H9/1092 ,  H03H9/25 ,  G01N2291/0423 ,  H01L2224/16

摘要： Methods for making laser-marked packaged surface acoustic wave devices are provided. The method may include directly marking a surface of a piezoelectric substrate, where the opposite surface of the piezoelectric substrate includes a package structure encapsulating a surface acoustic wave device. The method may include exposing the surface of the piezoelectric substrate to light from a deep ultraviolet laser. By using a wavelength readily absorbed by the piezoelectric substrate, a relatively shallow marking may be made in the piezoelectric substrate. The markings may extend less than 1 micrometer into the piezoelectric substrate, and do not affect the structural integrity of the piezoelectric substrate or the operation of the packaged surface acoustic wave device.

公开(公告)号：US11159137B2

公开(公告)日：2021-10-26

申请号：US16555985

申请日：2019-08-29

申请人： Skyworks Solutions, Inc.

发明人： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC分类号： H03H3/08 ,  H03H9/10 ,  H03H9/02 ,  B23K26/362 ,  H03H9/25 ,  H03H9/05

摘要： Methods of making packaged surface acoustic wave devices are provided. The method may include forming a photosensitive resin coat over a cavity-defining structure encapsulating a surface acoustic wave device. The photosensitive resin coat may be formed using a spin-coating process, and then patterned to form a desired shape. Portions of the photosensitive resin may be removed from areas near the edge of the die, to facilitate separation of a wafer into individual dies. The method may also include forming a conductive structure using a plating process, where the conductive structure is located between the resin coat and the cavity defining structure. The photosensitive resin can include a phenol resin. The packaged surface acoustic wave devices made using a photosensitive resin coat may be relatively thin, and may have a height of less than 220 micrometers.

公开(公告)号：US20200076399A1

公开(公告)日：2020-03-05

申请号：US16555901

申请日：2019-08-29

申请人： Skyworks Solutions, Inc.

发明人： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC分类号： H03H9/02 ,  H03H3/08 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25 ,  B23K26/362

摘要： Methods for making laser-marked packaged surface acoustic wave devices are provided. The method may include directly marking a surface of a piezoelectric substrate, where the opposite surface of the piezoelectric substrate includes a package structure encapsulating a surface acoustic wave device. The method may include exposing the surface of the piezoelectric substrate to light from a deep ultraviolet laser. By using a wavelength readily absorbed by the piezoelectric substrate, a relatively shallow marking may be made in the piezoelectric substrate. The markings may extend less than 1 micrometer into the piezoelectric substrate, and do not affect the structural integrity of the piezoelectric substrate or the operation of the packaged surface acoustic wave device.

公开(公告)号：US20240243716A1

公开(公告)日：2024-07-18

申请号：US18531065

申请日：2023-12-06

申请人： Skyworks Solutions, Inc.

发明人： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC分类号： H03H3/08 ,  B23K26/362 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25

CPC分类号： H03H3/08 ,  B23K26/362 ,  H03H9/02559 ,  H03H9/02622 ,  H03H9/059 ,  H03H9/1064 ,  H03H9/1092 ,  H03H9/25 ,  G01N2291/0423 ,  H01L2224/16

摘要： Laser-marked packaged surface acoustic wave devices are provided. The laser-marked packaged surface acoustic wave device may include a package structure encapsulating a surface acoustic wave device on a first side of a piezoelectric substrate. The opposite side of the piezoelectric substrate can be directly marked using a laser. The laser may be a deep ultraviolet laser. By directly marking the piezoelectric substrate itself, the use of a separate marking film can be avoided, making the packaged surface acoustic wave device thinner. When the laser has a wavelength readily absorbed by the piezoelectric substrate, a relatively shallow marking may be made in the piezoelectric substrate. The markings can extend less than 1 micrometer into the piezoelectric substrate, so as not to affect the structural integrity of the piezoelectric substrate or the operation of the packaged surface acoustic wave device.

公开(公告)号：US20200076400A1

公开(公告)日：2020-03-05

申请号：US16555904

申请日：2019-08-29

申请人： Skyworks Solutions, Inc.

发明人： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC分类号： H03H9/02 ,  H03H3/08 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25 ,  B23K26/362

摘要： Packaged surface acoustic wave devices are provided. The packaged surface acoustic wave devices are relatively thin and can have a height of less than 220 micrometers. The packaged surface acoustic wave device includes a photosensitive resin over a conductive structure which may be formed by a plating process. The conductive structure may overlie a cavity-defining structure encapsulating a surface acoustic wave device, the cavity-defining structure including walls and a roof. The photosensitive resin can include a phenol resin. The photosensitive resin can be relatively thin. Edge portions of a piezoelectric substrate can be free from the photosensitive resin.

公开(公告)号：US11894824B2

公开(公告)日：2024-02-06

申请号：US16555860

申请日：2019-08-29

申请人： Skyworks Solutions, Inc.

发明人： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC分类号： H03H9/02 ,  H03H3/08 ,  B23K26/362 ,  H03H9/10 ,  H03H9/25 ,  H03H9/05

CPC分类号： H03H3/08 ,  B23K26/362 ,  H03H9/02559 ,  H03H9/02622 ,  H03H9/059 ,  H03H9/1064 ,  H03H9/1092 ,  H03H9/25 ,  G01N2291/0423 ,  H01L2224/16

摘要： Laser-marked packaged surface acoustic wave devices are provided. The laser-marked packaged surface acoustic wave device may include a package structure encapsulating a surface acoustic wave device on a first side of a piezoelectric substrate. The opposite side of the piezoelectric substrate can be directly marked using a laser. The laser may be a deep ultraviolet laser. By directly marking the piezoelectric substrate itself, the use of a separate marking film can be avoided, making the packaged surface acoustic wave device thinner. When the laser has a wavelength readily absorbed by the piezoelectric substrate, a relatively shallow marking may be made in the piezoelectric substrate. The markings can extend less than 1 micrometer into the piezoelectric substrate, so as not to affect the structural integrity of the piezoelectric substrate or the operation of the packaged surface acoustic wave device.

公开(公告)号：US11777465B2

公开(公告)日：2023-10-03

申请号：US16555904

申请日：2019-08-29

申请人： Skyworks Solutions, Inc.

发明人： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC分类号： H03H9/25 ,  H03H3/08 ,  H03H9/02 ,  B23K26/362 ,  H03H9/10 ,  H03H9/05

CPC分类号： H03H3/08 ,  B23K26/362 ,  H03H9/02559 ,  H03H9/02622 ,  H03H9/059 ,  H03H9/1064 ,  H03H9/1092 ,  H03H9/25 ,  G01N2291/0423 ,  H01L2224/16

摘要： Packaged surface acoustic wave devices are provided. The packaged surface acoustic wave devices are relatively thin and can have a height of less than 220 micrometers. The packaged surface acoustic wave device includes a photosensitive resin over a conductive structure which may be formed by a plating process. The conductive structure may overlie a cavity-defining structure encapsulating a surface acoustic wave device, the cavity-defining structure including walls and a roof. The photosensitive resin can include a phenol resin. The photosensitive resin can be relatively thin. Edge portions of a piezoelectric substrate can be free from the photosensitive resin.

公开(公告)号：US20220006439A1

公开(公告)日：2022-01-06

申请号：US17364242

申请日：2021-06-30

申请人： Skyworks Solutions, Inc.

发明人： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC分类号： H03H3/08 ,  H03H9/02 ,  B23K26/362 ,  H03H9/10 ,  H03H9/25 ,  H03H9/05

摘要： Methods of making packaged surface acoustic wave devices are provided. The method may include forming a photosensitive resin coat over a cavity-defining structure encapsulating a surface acoustic wave device. The photosensitive resin coat may be formed using a spin-coating process, and then patterned to form a desired shape. Portions of the photosensitive resin may be removed from areas near the edge of the die, to facilitate separation of a wafer into individual dies. The method may also include forming a conductive structure using a plating process, where the conductive structure is located between the resin coat and the cavity defining structure. The photosensitive resin can include a phenol resin. The packaged surface acoustic wave devices made using a photosensitive resin coat may be relatively thin, and may have a height of less than 220 micrometers.

公开(公告)号：US11923817B2

公开(公告)日：2024-03-05

申请号：US17364242

申请日：2021-06-30

申请人： Skyworks Solutions, Inc.

发明人： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC分类号： H03H3/08 ,  B23K26/362 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25

CPC分类号： H03H3/08 ,  B23K26/362 ,  H03H9/02559 ,  H03H9/02622 ,  H03H9/059 ,  H03H9/1064 ,  H03H9/1092 ,  H03H9/25 ,  G01N2291/0423 ,  H01L2224/16

摘要： Methods of making packaged surface acoustic wave devices are provided. The method may include forming a photosensitive resin coat over a cavity-defining structure encapsulating a surface acoustic wave device. The photosensitive resin coat may be formed using a spin-coating process, and then patterned to form a desired shape. Portions of the photosensitive resin may be removed from areas near the edge of the die, to facilitate separation of a wafer into individual dies. The method may also include forming a conductive structure using a plating process, where the conductive structure is located between the resin coat and the cavity defining structure. The photosensitive resin can include a phenol resin. The packaged surface acoustic wave devices made using a photosensitive resin coat may be relatively thin, and may have a height of less than 220 micrometers.

公开(公告)号：US20200076402A1

公开(公告)日：2020-03-05

申请号：US16555985

申请日：2019-08-29

申请人： Skyworks Solutions, Inc.

发明人： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC分类号： H03H9/10 ,  H03H9/05

摘要： Methods of making packaged surface acoustic wave devices are provided. The method may include forming a photosensitive resin coat over a cavity-defining structure encapsulating a surface acoustic wave device. The photosensitive resin coat may be formed using a spin-coating process, and then patterned to form a desired shape. Portions of the photosensitive resin may be removed from areas near the edge of the die, to facilitate separation of a wafer into individual dies. The method may also include forming a conductive structure using a plating process, where the conductive structure is located between the resin coat and the cavity defining structure. The photosensitive resin can include a phenol resin. The packaged surface acoustic wave devices made using a photosensitive resin coat may be relatively thin, and may have a height of less than 220 micrometers.