Abstract:
A process is disclosed for purification of silicon source material including trichlorosilane. First, the silicon source material in liquid state with impurities vapor and the other chlorosilane or silane are passing a first high gravity rotating packed bed with porous metal, at a temperature lower than the boiling point of the silicon source material, the impurities vapor and the other chlorosilane or silane are separated from the liquid silicon source material; second, the silicon source material in liquid state is fed to a second high gravity rotating packed bed, oxygen is also fed to the second high gravity rotating packed bed to form impurity-containing siloxane complexes with higher boiling point. Finally distilling to remove the impurity-containing siloxane complexes from the silicon source material.
Abstract:
A process is disclosed for purification of silicon source material including trichlorosilane. First, the silicon source material in liquid state with impurities vapor and the other chlorosilane or silane are passing a first high gravity rotating packed bed with spongy metal, at a temperature lower than the boiling point of the silicon source material, the impurities vapor and the other chlorosilane or silane are separated from the liquid silicon source material; second, the silicon source material in liquid state is fed to a second high gravity rotating packed bed, oxygen is also fed to the second high gravity rotating packed bed to form impurity containing siloxane complexes with higher boiling point. Finally distilling to remove the impurity containing siloxane complexes from the silicon source material.
Abstract:
A membrane type integrated inductor includes an integrated inductor laid out on the upper plane of a membrane. The process to manufacture a membrane type integrated inductor includes the following steps: forming a thin dielectric layer at the outer portion of a substrate; forming a wire-wound integrated inductor thin dielectric layer with the known technique; defining an open window on the back of the substrate below the inductor through the backside etch; and forming a membrane type integrated inductor by using the thin dielectric layer on the silicon substrate as the etching stop. One embodiment uses silicon dioxide as the membrane layer. The low dielectric constant of SiO.sub.2 may be used to lower the power loss during the lay out of the circuit parts, to effectively raise the induction value, to lower the parasitic capacitance, to increase the resonance frequency, to decrease the volume of the chip which the inductor utilized, and to raise the quality factor.
Abstract:
A combinational inductor, which can be constructed on a surface of a semiconductor substrate or an isolator, is provided. The combinational inductor includes several spiral inductors which are connected together in series. The spiral inductors can be constructed on the same layer to produce a combinational inductor structure, because of the same metalization process used. In another aspect, connecting methods between neighboring spiral conductors include forward cascade and reverse cascade. A spiral conductor has at least one neighboring spiral conductor which is connected with it in reverse cascade. The inductance per unit square measurement of the inductor in series can be significantly increased through the connections between neighboring spiral conductors either in forward cascade or reverse cascade.