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公开(公告)号：US20130070409A1
公开(公告)日：2013-03-21
申请号：US13236323
申请日：2011-09-19
CPC分类号： G06F1/20
摘要： An information handling system (IHS) cooling system includes an IHS chassis defining an IHS chassis air inlet. A cooling chassis supports the IHS chassis on a support base. An air supply duct extends from the cooling chassis such that an air supply duct outlet on the air supply duct is immediately adjacent the IHS chassis air inlet. An air cooling subsystem is located in the cooling chassis and is operable to cool air that is drawn into the cooling chassis and supply the cooled air to the IHS chassis air inlet through the air supply duct. The IHS chassis may be a conventional IHS chassis that is designed for sub-35 degree Celsius ambient temperatures, and the cooling chassis may be provided for the conventional IHS chassis when used in extreme environments with high ambient temperatures above 35 degrees Celsius.
摘要翻译： 信息处理系统（IHS）冷却系统包括一个定义IHS机箱空气入口的IHS底盘。 冷却底盘支持基座上的IHS机箱。 空气供应管道从冷却底盘延伸，使得空气供应管道上的空气供应管道出口紧邻IHS底盘空气入口。 空气冷却子系统位于冷却底盘中，并且可操作以冷却被抽入冷却底盘中的空气并将冷却的空气通过空气供应管道供应到IHS底盘空气入口。 IHS机箱可能是常规IHS机箱，其设计用于低于摄氏35度的环境温度，并且当在高于35摄氏度的高环境温度的极端环境中使用时，可以为常规IHS机箱提供冷却底盘。
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公开(公告)号：US08634192B2
公开(公告)日：2014-01-21
申请号：US13236323
申请日：2011-09-19
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： An information handling system (IHS) cooling system includes an IHS chassis defining an IHS chassis air inlet. A cooling chassis supports the IHS chassis on a support base. An air supply duct extends from the cooling chassis such that an air supply duct outlet on the air supply duct is immediately adjacent the IHS chassis air inlet. An air cooling subsystem is located in the cooling chassis and is operable to cool air that is drawn into the cooling chassis and supply the cooled air to the IHS chassis air inlet through the air supply duct. The IHS chassis may be a conventional IHS chassis that is designed for sub-35 degree Celsius ambient temperatures, and the cooling chassis may be provided for the conventional IHS chassis when used in extreme environments with high ambient temperatures above 35 degrees Celsius.
摘要翻译： 信息处理系统（IHS）冷却系统包括一个定义IHS机箱空气入口的IHS底盘。 冷却底盘支持基座上的IHS机箱。 空气供应管道从冷却底盘延伸，使得空气供应管道上的空气供应管道出口紧邻IHS底盘空气入口。 空气冷却子系统位于冷却底盘中，并且可操作以冷却被抽入冷却底盘中的空气并将冷却的空气通过空气供应管道供应到IHS底盘空气入口。 IHS机箱可能是常规IHS机箱，其设计用于低于摄氏35度的环境温度，并且当在高于35摄氏度的高环境温度的极端环境中使用时，可以为常规IHS机箱提供冷却底盘。
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公开(公告)号：US07734858B2
公开(公告)日：2010-06-08
申请号：US11412279
申请日：2006-04-27
CPC分类号： G06F13/4022
摘要： An interposer module may be used between a unified architecture blade compute module and a mid-plane of a present technology blade compute module system. The interposer module may contain input-output controllers for desired input-output fabrics. The mid-plane couples these input-output controllers to associated input-output fabric switches. The same unified architecture blade compute module may also be used without the interposer module in a new technology blade compute module system having multi-context fabric input-output controllers. The multi-context fabric input-output controllers may be coupled to the unified architecture blade compute modules of the information handling system by a switch such as a PCI Express (PCIe) switch.
摘要翻译： 可以在统一架构刀片计算模块和当前技术的刀片计算模块系统的中间平面之间使用插入器模块。 插入器模块可以包含用于期望的输入 - 输出结构的输入 - 输出控制器。 中间平面将这些输入输出控制器耦合到相关的输入输出结构交换机。 也可以在具有多上下文结构输入 - 输出控制器的新技术刀片计算模块系统中使用相同的统一架构刀片计算模块而没有中介器模块。 多上下文结构输入 - 输出控制器可以通过诸如PCI Express（PCIe）交换机的交换机耦合到信息处理系统的统一架构刀片计算模块。
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4.发明授权Heat conduction apparatus providing for selective configuration for heat conduction 有权导热装置提供用于热传导的选择性配置公开(公告)号：US07719839B2
公开(公告)日：2010-05-18
申请号：US11676422
申请日：2007-02-19
申请人： Shawn Paul Hoss , David Lyle Moss
发明人： Shawn Paul Hoss , David Lyle Moss
CPC分类号： H01L23/34 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： In an embodiment, a heat conduction apparatus includes a heat sink. A coupling member is located on the heat sink. The coupling member is operable to releaseably and interchangeably couple one of a selected blank member and a cold plate to the heat sink in response to a cooling requirement of the heat sink. In an embodiment, a method of cooling an information handling system includes providing cooling by coupling a heat sink to a heat generating component. The method further provides selectably coupling a blank member to the heat sink providing cooling by a first fluid coolant. The method further provides selectably coupling a cold plate to the heat sink providing cooling by a first fluid coolant and a second fluid coolant.
摘要翻译： 在一个实施例中，导热装置包括散热器。 耦合构件位于散热器上。 联接构件可操作以响应于散热器的冷却要求而将所选择的空白构件和冷板中的一个可释放地和可互换地耦合到散热器。 在一个实施例中，冷却信息处理系统的方法包括通过将散热器耦合到发热部件来提供冷却。 该方法进一步提供可选地将空白构件耦合到散热器，由第一流体冷却剂提供冷却。 该方法还提供了将冷板可选择地耦合到散热器，由第一流体冷却剂和第二流体冷却剂提供冷却。
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5.发明申请公开(公告)号：US20080198551A1
公开(公告)日：2008-08-21
申请号：US11676422
申请日：2007-02-19
申请人： Shawn Paul Hoss , David Lyle Moss
发明人： Shawn Paul Hoss , David Lyle Moss
IPC分类号： H05K7/20
CPC分类号： H01L23/34 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： In an embodiment, a heat conduction apparatus includes a heat sink. A coupling member is located on the heat sink. The coupling member is operable to releaseably and interchangeably couple one of a selected blank member and a cold plate to the heat sink in response to a cooling requirement of the heat sink. In an embodiment, a method of cooling an information handling system includes providing cooling by coupling a heat sink to a heat generating component. The method further provides selectably coupling a blank member to the heat sink providing cooling by a first fluid coolant. The method further provides selectably coupling a cold plate to the heat sink providing cooling by a first fluid coolant and a second fluid coolant.
摘要翻译： 在一个实施例中，导热装置包括散热器。 耦合构件位于散热器上。 联接构件可操作以响应于散热器的冷却要求而将所选择的空白构件和冷板中的一个可释放地和可互换地耦合到散热器。 在一个实施例中，冷却信息处理系统的方法包括通过将散热器耦合到发热部件来提供冷却。 该方法进一步提供可选地将空白构件耦合到散热器，由第一流体冷却剂提供冷却。 该方法还提供了将冷板可选择地耦合到散热器，由第一流体冷却剂和第二流体冷却剂提供冷却。
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