专利检索 ap:("Seagate Technology LLC") AND inv:"Weilu H. Xu" 第 1 页

1.

发明授权
Laser cutting array with multiple laser source arrangement 有权

公开(公告)号：US10384306B1

公开(公告)日：2019-08-20

申请号：US15171697

申请日：2016-06-02

申请人： Seagate Technology LLC

发明人： Ian J. Beresford , Joachim Walter Ahner , David M. Tung , Weilu H. Xu , Kuo-Hsing Hwang

IPC分类号： B23K26/08 , B23K26/06 , B29D17/00 , C03B33/10 , C03C23/00 , B23K26/38 , B23K26/402 , B29K105/00 , B23K103/00

摘要： Provided herein is an apparatus that includes a first and second laser source. The first and second laser sources are each operable to cut a substrate and are each independently movable with respect to one another. Further, the first and second laser sources are included within a multitude of laser sources that are arranged in a circular array.