Invention Grant
- Patent Title: Laser cutting array with multiple laser source arrangement
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Application No.: US15171697Application Date: 2016-06-02
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Publication No.: US10384306B1Publication Date: 2019-08-20
- Inventor: Ian J. Beresford , Joachim Walter Ahner , David M. Tung , Weilu H. Xu , Kuo-Hsing Hwang
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Main IPC: B23K26/08
- IPC: B23K26/08 ; B23K26/06 ; B29D17/00 ; C03B33/10 ; C03C23/00 ; B23K26/38 ; B23K26/402 ; B29K105/00 ; B23K103/00
Abstract:
Provided herein is an apparatus that includes a first and second laser source. The first and second laser sources are each operable to cut a substrate and are each independently movable with respect to one another. Further, the first and second laser sources are included within a multitude of laser sources that are arranged in a circular array.
Information query
