Probe card with stacked substrate
    1.
    发明授权
    Probe card with stacked substrate 有权
    带堆叠衬底的探头卡

    公开(公告)号:US07898276B2

    公开(公告)日:2011-03-01

    申请号:US11885479

    申请日:2006-02-21

    IPC分类号: G01R31/26

    CPC分类号: G01R1/073 G01R1/07307

    摘要: A probe card is provided including a first substrate, a second substrate, and a plurality of conductive wires extending between the first substrate and the second substrate. The conductive wires are fixed (a) at a first end to a contact of the first substrate, and (b) at a second end to a contact of the second substrate.

    摘要翻译: 提供一种探针卡,包括第一基板,第二基板和在第一基板和第二基板之间延伸的多根导电线。 导线在第一端被固定(a)到第一基板的接触部,(b)在第二端部与第二基板接触。

    Probe Card With Stacked Substrate
    2.
    发明申请
    Probe Card With Stacked Substrate 有权
    带堆叠基板的探头卡

    公开(公告)号:US20080246501A1

    公开(公告)日:2008-10-09

    申请号:US11885479

    申请日:2006-02-21

    IPC分类号: G01R1/073

    CPC分类号: G01R1/073 G01R1/07307

    摘要: A probe card is provided including a first substrate, a second substrate, and a plurality of conductive wires extending between the first substrate and the second substrate. The conductive wires are fixed (a) at a first end to a contact of the first substrate, and (b) at a second end to a contact of the second substrate.

    摘要翻译: 提供一种探针卡,包括第一基板,第二基板和在第一基板和第二基板之间延伸的多根导电线。 导线在第一端被固定(a)到第一基板的接触部,(b)在第二端部与第二基板接触。

    Approach for fabricating cantilever probes for probe card assemblies
    3.
    发明授权
    Approach for fabricating cantilever probes for probe card assemblies 有权
    用于制造探针卡组件的悬臂探头的方法

    公开(公告)号:US07637007B2

    公开(公告)日:2009-12-29

    申请号:US11704050

    申请日:2007-02-07

    IPC分类号: H01K3/02 B23P6/00 H01L21/76

    摘要: An approach for fabricating cantilever probes for a probe card assembly includes forming posts on conductive traces on a substrate. A beam panel having beam elements formed therein is aligned to the substrate so that the beam elements are in contact with the plurality of posts. Each beam element is in contact with a post at a portion of the beam element so that both a first end portion and a second end portion overhang the post element. Each beam element is also attached to the beam panel by the first end portion. The beam elements are bonded to the plurality of posts. The first end portion of each beam element is cut, for example using an electrode, laser ablation or by dicing, to release the beam element from the beam panel. The beam panel is then removed, leaving the beam elements attached to the posts.

    摘要翻译: 用于制造用于探针卡组件的悬臂探针的方法包括在基底上的导电迹线上形成柱。 其中形成有梁元件的梁板与衬底对准,使得梁元件与多个柱接触。 每个梁元件在梁元件的一部分处与柱接触,使得第一端部和第二端部部分都悬置在柱元件上。 每个梁元件也通过第一端部附接到梁板。 梁元件结合到多个柱。 每个光束元件的第一端部例如使用电极,激光烧蚀或通过切割来切割,以将光束元件从光束面板释放。 然后将梁板移除,使梁元件附接到柱上。

    Automated probe card planarization and alignment methods and tools
    4.
    发明授权
    Automated probe card planarization and alignment methods and tools 有权
    自动探针卡平面化和对准方法和工具

    公开(公告)号:US07583098B2

    公开(公告)日:2009-09-01

    申请号:US11703891

    申请日:2007-02-07

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2891 G01R1/07342

    摘要: A method and apparatus for performing automated alignment of probes of a probe card is provided. The desired horizontal location for a probe is compared with the actual horizontal position for the probe to determine a horizontal correction distance and a horizontal correction direction to correct a horizontal alignment for the probe. A first tool automatically corrects the horizontal alignment for the probe based on the horizontal correction distance and the horizontal correction direction. Upon determining that an actual vertical position of the probe is closer to the probe card than a desired vertical position, a second tool automatically changes the actual vertical position of the probe to the desired vertical position. Upon determining that the actual vertical position of the probe is farther from the probe card than the desired vertical position, a third tool automatically changes the actual vertical position of the probe to the desired vertical position.

    摘要翻译: 提供了用于执行探针卡的探针的自动对准的方法和装置。 将探针的期望水平位置与探针的实际水平位置进行比较,以确定水平校正距离和水平校正方向以校正探针的水平对准。 第一个工具根据水平校正距离和水平校正方向自动校正探头的水平对准。 当确定探头的实际垂直位置比期望的垂直位置更靠近探针卡时,第二工具自动将探头的实际垂直位置改变到期望的垂直位置。 当确定探针的实际垂直位置比探针卡比期望的垂直位置更远时,第三工具自动将探头的实际垂直位置改变到期望的垂直位置。

    Beam assembly method for large area array multi-beam DUT probe cards
    5.
    发明申请
    Beam assembly method for large area array multi-beam DUT probe cards 有权
    大面积阵列多波束DUT探针卡的束组装方法

    公开(公告)号:US20070251080A1

    公开(公告)日:2007-11-01

    申请号:US11713956

    申请日:2007-02-27

    IPC分类号: H01B13/00 H01R43/16

    摘要: A method for fabricating beams for a probe card includes dividing a large beam panel into smaller sub-panels before attaching the beams to corresponding posts on a substrate. Each sub-panel may have a sufficient number of beams to test several devices under test. The beam sub-panels may be aligned to the space transformer using alignment fiducials on the beam sub-panels that correspond to opposing alignment features formed in the space transformer or other substrate. Special tie-bars may be formed between: (1) rows, for example, of beams and the frame/frame splines (i.e., quadrant tie-bars); and (2) adjacent beams within any such rows on the beam panel (i.e., beam tie-bars). The approach may also include the use of tip tie-bars and/or tail tie-bars.

    摘要翻译: 一种用于制造用于探针卡的光束的方法,包括在将光束附着到基板上的相应的柱之后,将大的光束板划分成更小的子面板。 每个子面板可以具有足够数量的光束来测试被测试的多个器件。 梁子板可以使用对应于形成在空间变压器或其它基板中的相对的对准特征的梁子板上的对准基准线与空间变压器对准。 特殊的连接杆可以形成在:(1)行,例如梁和框架/框架花键(即,象限连接杆); 和(2)在梁板上的任何这样的行中的相邻梁(即梁连杆)。 该方法还可以包括使用尖端连接杆和/或尾部连接杆。

    Automated probe card planarization and alignment methods and tools
    6.
    发明申请
    Automated probe card planarization and alignment methods and tools 有权
    自动探针卡平面化和对准方法和工具

    公开(公告)号:US20070216431A1

    公开(公告)日:2007-09-20

    申请号:US11703891

    申请日:2007-02-07

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2891 G01R1/07342

    摘要: A method and apparatus for performing automated alignment of probes of a probe card is provided. The desired horizontal location for a probe is compared with the actual horizontal position for the probe to determine a horizontal correction distance and a horizontal correction direction to correct a horizontal alignment for the probe. A first tool automatically corrects the horizontal alignment for the probe based on the horizontal correction distance and the horizontal correction direction. Upon determining that an actual vertical position of the probe is closer to the probe card than a desired vertical position, a second tool automatically changes the actual vertical position of the probe to the desired vertical position. Upon determining that the actual vertical position of the probe is farther from the probe card than the desired vertical position, a third tool automatically changes the actual vertical position of the probe to the desired vertical position.

    摘要翻译: 提供了用于执行探针卡的探针的自动对准的方法和装置。 将探针的期望水平位置与探针的实际水平位置进行比较,以确定水平校正距离和水平校正方向以校正探针的水平对准。 第一个工具根据水平校正距离和水平校正方向自动校正探头的水平对准。 当确定探头的实际垂直位置比期望的垂直位置更靠近探针卡时,第二工具自动将探头的实际垂直位置改变到期望的垂直位置。 当确定探针的实际垂直位置比探针卡比期望的垂直位置更远时,第三工具自动将探头的实际垂直位置改变到期望的垂直位置。

    Low force interconnects for probe cards
    8.
    发明授权
    Low force interconnects for probe cards 有权
    用于探针卡的低力互连

    公开(公告)号:US07733104B2

    公开(公告)日:2010-06-08

    申请号:US12106827

    申请日:2008-04-21

    IPC分类号: G01R31/02

    CPC分类号: G01R1/07342 G01R1/07378

    摘要: A probe test card assembly for testing of a device under test includes a printed circuit board, a substrate and a substrate support structure. The substrate support structure holds the substrate in position with respect to the printed circuit board. The substrate support structure may include one or more alignment members, one or more hard stop members and/or a support plate attached to the printed circuit board for positioning the substrate with respect to the printed circuit board. The one or more alignment members may extend through the printed circuit board and be connected to the one or more printed circuit board stiffener members. The probe test card assembly may also employ a proximity detection feature to indicate when the substrate is in a particular position with respect to the printed circuit board.

    摘要翻译: 用于测试被测器件的探针测试卡组件包括印刷电路板,衬底和衬底支撑结构。 基板支撑结构将基板保持在相对于印刷电路板的位置。 衬底支撑结构可以包括一个或多个对准构件,一个或多个硬止动构件和/或附接到印刷电路板的支撑板,用于相对于印刷电路板定位衬底。 一个或多个对准构件可延伸穿过印刷电路板并连接到一个或多个印刷电路板加强构件。 探针测试卡组件还可以采用接近检测特征来指示衬底何时位于相对于印刷电路板的特定位置。

    Beam assembly method for large area array multi-beam DUT probe cards
    9.
    发明授权
    Beam assembly method for large area array multi-beam DUT probe cards 有权
    大面积阵列多波束DUT探针卡的束组装方法

    公开(公告)号:US07637006B2

    公开(公告)日:2009-12-29

    申请号:US11713956

    申请日:2007-02-27

    IPC分类号: H05K3/20 G01R31/02

    摘要: A method for fabricating beams for a probe card includes dividing a large beam panel into smaller sub-panels before attaching the beams to corresponding posts on a substrate. Each sub-panel may have a sufficient number of beams to test several devices under test. The beam sub-panels may be aligned to the space transformer using alignment fiducials on the beam sub-panels that correspond to opposing alignment features formed in the space transformer or other substrate. Special tie-bars may be formed between: (1) rows, for example, of beams and the frame/frame splines (i.e., quadrant tie-bars); and (2) adjacent beams within any such rows on the beam panel (i.e., beam tie-bars). The approach may also include the use of tip tie-bars and/or tail tie-bars.

    摘要翻译: 一种用于制造用于探针卡的光束的方法,包括在将光束附着到基板上的相应的柱之后,将大的光束板划分成更小的子面板。 每个子面板可以具有足够数量的光束来测试被测试的多个器件。 梁子板可以使用对应于形成在空间变压器或其他基板中的相对的对准特征的梁子板上的对准基准面与空间变压器对准。 特殊的连接杆可以形成在:(1)行,例如梁和框架/框架花键(即,象限连接杆); 和(2)在梁板上的任何这样的行中的相邻梁(即梁连杆)。 该方法还可以包括使用尖端连接杆和/或尾部连接杆。

    Low Force Interconnects For Probe Cards
    10.
    发明申请
    Low Force Interconnects For Probe Cards 有权
    低力量互连用于探针卡

    公开(公告)号:US20090261849A1

    公开(公告)日:2009-10-22

    申请号:US12106827

    申请日:2008-04-21

    IPC分类号: G01R1/073

    CPC分类号: G01R1/07342 G01R1/07378

    摘要: A probe test card assembly for testing of a device under test includes a printed circuit board, a substrate and a substrate support structure. The substrate support structure holds the substrate in position with respect to the printed circuit board. The substrate support structure may include one or more alignment members, one or more hard stop members and/or a support plate attached to the printed circuit board for positioning the substrate with respect to the printed circuit board. The one or more alignment members may extend through the printed circuit board and be connected to the one or more printed circuit board stiffener members. The probe test card assembly may also employ a proximity detection feature to indicate when the substrate is in a particular position with respect to the printed circuit board.

    摘要翻译: 用于测试被测器件的探针测试卡组件包括印刷电路板,衬底和衬底支撑结构。 基板支撑结构将基板保持在相对于印刷电路板的位置。 衬底支撑结构可以包括一个或多个对准构件,一个或多个硬止动构件和/或附接到印刷电路板的支撑板,用于相对于印刷电路板定位衬底。 一个或多个对准构件可延伸穿过印刷电路板并连接到一个或多个印刷电路板加强构件。 探针测试卡组件还可以采用接近检测特征来指示衬底何时位于相对于印刷电路板的特定位置。