公开(公告)号：US20100151627A1

公开(公告)日：2010-06-17

申请号：US12503004

申请日：2009-07-14

Applicant: Sang Jin KIM ,  YongSoo OH ,  Hwan-Soo LEE

Inventor： Sang Jin KIM ,  YongSoo OH ,  Hwan-Soo LEE

IPC: H01L21/78 ,  H01L21/50

CPC classification number: H01L27/1266 ,  H01L27/1214 ,  H01L27/1218 ,  H01L29/78603

Abstract: A method for fabricating a thin film device includes the step of forming a sacrificial layer on a first substrate. A portion other than a region of the sacrificial layer is selectively removed. A material film is formed on the sacrificial layer to be connected to the first substrate via the selectively removed region. The material film portion filled in the selectively removed region is provided as an anchor. A thin film lamination is formed on the material film. The desired thin film device is formed by using a selective etching process. After removing the sacrificial layer, the thin film device floats over the first substrate with being supported by the anchor. A support body is temporarily attached on the thin film lamination. The thin film device is transferred to the support body onto a second substrate.

Abstract translation: 制造薄膜器件的方法包括在第一衬底上形成牺牲层的步骤。 选择性地除去除了牺牲层的区域之外的部分。 在牺牲层上形成材料膜，以经由选择性去除的区域连接到第一衬底。 填充在选择性去除区域中的材料膜部分被设置为锚固件。 在材料膜上形成薄膜层压体。 通过使用选择性蚀刻工艺形成所需的薄膜器件。 在去除牺牲层之后，薄膜装置在被锚固件支撑的情况下漂浮在第一基板上。 支撑体临时附着在薄膜层压板上。 薄膜器件被转移到支撑体上到第二衬底上。