公开(公告)号：US10094874B1

公开(公告)日：2018-10-09

申请号：US15208931

申请日：2016-07-13

Applicant: Sandia Corporation

Inventor： Paiboon Tangyunyong ,  Edward I. Cole, Jr. ,  Guillermo M. Loubriel ,  Joshua Beutler

IPC: G01R31/307 ,  G01R27/28 ,  G01R31/303 ,  G01R31/311

Abstract: A visualization method for screening electronic devices is provided. In accordance with the disclosed method, a probe is applied to a grid of multiple points on the circuit, and an output produced by the circuit in response to the stimulus waveform is monitored for each of multiple grid points where the probe is applied. A power spectrum analysis (PSA) produces a power spectrum amplitude, in each of one or more frequency bins, on the monitored output for each of the multiple grid points. The PSA provides a respective pixel value for each of the multiple grid points. An image is displayed, in which image portions representing the multiple grid points are displayed with the respective pixel values.

公开(公告)号：US09599667B1

公开(公告)日：2017-03-21

申请号：US14836713

申请日：2015-08-26

Applicant: Sandia Corporation

Inventor： Joshua Beutler ,  John Joseph Clement ,  Mary A. Miller ,  Jeffrey Stevens ,  Edward I. Cole, Jr.

IPC: G01N21/00 ,  G01R31/311 ,  H01L21/66 ,  H01L21/3065 ,  H01L21/67 ,  G01N21/95

CPC classification number: G01R31/311 ,  G01N21/9501 ,  G01N2021/95638 ,  H01L22/12 ,  H01L22/14

Abstract: The various technologies presented herein relate to utilizing visible light in conjunction with a thinned structure to enable characterization of operation of one or more features included in an integrated circuit (IC). Short wavelength illumination (e.g., visible light) is applied to thinned samples (e.g., ultra-thinned samples) to achieve a spatial resolution for laser voltage probing (LVP) analysis to be performed on smaller technology node silicon-on-insulator (SOI) and bulk devices. Thinning of a semiconductor material included in the IC (e.g., backside material) can be controlled such that the thinned semiconductor material has sufficient thickness to enable operation of one or more features comprising the IC during LVP investigation.