公开(公告)号：US20200303445A1

公开(公告)日：2020-09-24

申请号：US16898610

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung KANG ,  Yungcheol KONG ,  Hyunsu JUN ,  Kyoungsei CHOI

IPC: H01L27/146 ,  H01L31/0203 ,  H01L23/00 ,  H01L31/024

Abstract: A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.

公开(公告)号：US20180040658A1

公开(公告)日：2018-02-08

申请号：US15583224

申请日：2017-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung KANG ,  Yungcheol KONG ,  Hyunsu JUN ,  Kyoungsei CHOI

IPC: H01L27/146 ,  H01L23/00 ,  H01L31/024

CPC classification number: H01L27/14634 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14645 ,  H01L27/1469 ,  H01L31/0203 ,  H01L31/024 ,  H01L2224/16227

Abstract: A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.

公开(公告)号：US20190206832A1

公开(公告)日：2019-07-04

申请号：US16295276

申请日：2019-03-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung KANG ,  Yungcheol KONG ,  Kyoungsei CHOI

IPC: H01L25/04 ,  H01L27/146 ,  H01L23/49 ,  H01L23/528

Abstract: Provided are a stacked image sensor package and a packaging method thereof. A stacked image sensor package includes: a stacked image sensor in which a pixel array die and a logic die are stacked; a redistribution layer formed on one surface of the stacked image sensor, rerouting an input/output of the stacked image sensor, and including a first pad and a second pad; a memory die connected with the first pad of the redistribution layer and positioned on the stacked image sensor; and external connectors connected with the second pad, connecting the memory die and the stacked image sensor with an external device, and having the memory die positioned therebetween.

公开(公告)号：US20180040584A1

公开(公告)日：2018-02-08

申请号：US15469837

申请日：2017-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung KANG ,  Yungcheol KONG ,  Kyoungsei CHOI

IPC: H01L25/04 ,  H01L23/49 ,  H01L27/146 ,  H01L23/528

CPC classification number: H01L25/043 ,  H01L23/49 ,  H01L23/528 ,  H01L27/14609 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14665 ,  H01L2224/73204

Abstract: Provided are a stacked image sensor package and a packaging method thereof. A stacked image sensor package includes: a stacked image sensor in which a pixel array die and a logic die are stacked; a redistribution layer formed on one surface of the stacked image sensor, rerouting an input/ output of the stacked image sensor, and including a first pad and a second pad; a memory die connected with the first pad of the redistribution layer and positioned on the stacked image sensor; and external connectors connected with the second pad, connecting the memory die and the stacked image sensor with an external device, and having the memory die positioned therebetween.