公开(公告)号：US20140175474A1

公开(公告)日：2014-06-26

申请号：US13967733

申请日：2013-08-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Heon HAN ,  Jong Pa HONG ,  Seung Hyun KIM ,  Yun Hee SHIN ,  Jeong Wook LEE

IPC: H01L33/00

CPC classification number: H01L33/007 ,  H01L33/20 ,  H01L2933/0091

Abstract: A method of manufacturing a semiconductor light emitting device, includes: forming a plurality of concave portions on a substrate; injecting silica particles into the plurality of concave portions; and forming a semiconductor layer on the substrate, the semiconductor layer including voids formed in portions of the semiconductor layer, the portions being located above the plurality of concave portions.

Abstract translation: 一种半导体发光器件的制造方法，包括：在基板上形成多个凹部; 将二氧化硅颗粒注入到所述多个凹部中; 以及在所述基板上形成半导体层，所述半导体层包括在所述半导体层的部分中形成的空隙，所述半导体层位于所述多个凹部的上方。