公开(公告)号：US09947554B2

公开(公告)日：2018-04-17

申请号：US15345534

申请日：2016-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonseok Choi ,  Ilho Kim ,  Changho Kim

IPC: H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/373 ,  H01L23/31

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/373 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68318 ,  H01L2221/68386 ,  H01L2224/02331 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2924/3511

Abstract: A support substrate, a method of manufacturing a semiconductor package, and a semiconductor package, the support substrate including a first plate; a second plate on the first plate; and an adhesive layer between the first plate and the second plate, wherein a coefficient of thermal expansion (CTE) of the adhesive layer is higher than a CTE of the first plate and higher than a CTE of the second plate.