Semiconductor device
    1.
    发明授权

    公开(公告)号:US12052856B2

    公开(公告)日:2024-07-30

    申请号:US17657202

    申请日:2022-03-30

    CPC classification number: H10B12/315 H10B12/34

    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate which includes a cell region and a core region, a boundary element separation film which is placed inside the substrate, and separates the cell region and the core region, and a bit line which is placed on the cell region and the boundary element separation film and extends along a first direction, in which the boundary element separation film includes a first region and a second region, a height of an upper side of the first region of the boundary element separation film is different from a height of an upper side of the second region of the boundary element separation film, on a basis of a bottom side of the boundary element separation film, and the bit line is placed over the first region and the second region of the boundary element separation film.

    SEMICONDUCTOR MEMORY DEVICE
    2.
    发明公开

    公开(公告)号:US20240292602A1

    公开(公告)日:2024-08-29

    申请号:US18462614

    申请日:2023-09-07

    CPC classification number: H10B12/482 H10B12/315 H10B12/488

    Abstract: A semiconductor memory device includes a bit line extended in a first direction on a substrate, a first word line extended in a second direction on the bit line, a second word line extended in the second direction on the bit line and spaced apart from the first word line in the first direction, a back gate electrode between the first word line and the second word line and extended in the second direction, a first active pattern between the first word line and the back gate electrode on the bit line, and a second active pattern between the first word line and the back gate electrode on the bit.

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