公开(公告)号：US20240194542A1

公开(公告)日：2024-06-13

申请号：US18364119

申请日：2023-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghyun PARK ,  Yongil KWAK ,  Jekook LYU ,  Heeju SEO

IPC: H01L21/66 ,  G01R31/28 ,  H01L25/065

CPC classification number: H01L22/34 ,  G01R31/2893 ,  H01L22/32 ,  H01L25/0655

Abstract: Provided are a substrate including a test circuit capable of testing a damaged state thereof. The substrate includes a substrate body, and a test circuit arranged on at least one of an upper surface and a lower surface of the substrate body, wherein the test circuit includes two contact pads and at least one test wiring, the two contact pads being at an end portion of the substrate body and configured to contact two probe pins of a test element, the test wiring extending to surround an outer periphery portion of the substrate body and configured to connect the two contact pads to each other, and wherein, in an electrical test using the test element, when the test wiring is in a closed state, the substrate body is determined as normal, and when the test wiring is in an open state, the substrate body is determined as defective.