公开(公告)号：US20190259742A1

公开(公告)日：2019-08-22

申请号：US16177968

申请日：2018-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Gil Han ,  Seung-Lo Lee ,  Yong-je Lee ,  Sung-Il Cho

IPC: H01L25/18 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor package includes a package substrate, at least one first semiconductor chip on the package substrate and having a first height as measured from the package substrate, at least one second semiconductor chip on the package substrate spaced apart from the first semiconductor chip and having a second height less than the first height as measured from the package substrate, at least one third semiconductor chip stacked on the first and second semiconductor chips, and at least one support structure between the at least one second semiconductor chip and the at least one third semiconductor chip configured to support the at least one third semiconductor chip.