公开(公告)号：US11946154B2

公开(公告)日：2024-04-02

申请号：US17126902

申请日：2020-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungjun Kim ,  Chan Kwak ,  Takayoshi Sasaki ,  Yasuo Ebina ,  Changsoo Lee ,  Dohwon Jung ,  Giyoung Jo ,  Takaaki Taniguchi

IPC: C03C17/23 ,  C03C17/00 ,  C30B1/02

CPC classification number: C30B1/023 ,  C03C17/001 ,  C03C17/23 ,  C04B2235/3258 ,  C04B2235/768

Abstract: Provided are a dielectric material, a device including the dielectric material, and a method of preparing the dielectric material, in which the dielectric material may include: a layered perovskite compound, wherein the layered perovskite compound may include at least one selected from a Dion-Jacobson phase, an Aurivillius phase, and a Ruddlesden-Popper phase, a temperature coefficient of capacitance (TCC) of a capacitance at 200° C. with respect to a capacitance at 40° C. may be in a range of about −15 percent (%) to about 15%, and a permittivity of the dielectric material may be 200 or greater in a range of about 1 kilohertz (kHz) to about 1 megahertz (MHz).