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    LIGHT EMITTING DEVICE PACKAGE
    1.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 审中-公开

    公开(公告)号：US20180269192A1

    公开(公告)日：2018-09-20

    申请号：US15971196

    申请日：2018-05-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： YONG IL KIM ,  Wan Tae LIM ,  Young Jin CHOI ,  Sung Hyun SIM

    IPC: H01L25/16 ,  H01L33/06 ,  H01L33/50 ,  H01L33/32 ,  H01L33/54 ,  H01L27/12

    CPC classification number: H01L25/167 ,  H01L27/124 ,  H01L27/15 ,  H01L27/153 ,  H01L33/06 ,  H01L33/32 ,  H01L33/50 ,  H01L33/54

    Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

    LIGHT EMITTING DEVICE PACKAGE
    2.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 有权

    公开(公告)号：US20180068991A1

    公开(公告)日：2018-03-08

    申请号：US15802493

    申请日：2017-11-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： YONG IL KIM ,  Wan Tae LIM ,  Young Jin CHOI ,  Sung Hyun SIM

    IPC: H01L25/16 ,  H01L27/12 ,  H01L33/32 ,  H01L33/06 ,  H01L33/54 ,  H01L33/50

    CPC classification number: H01L25/167 ,  H01L27/124 ,  H01L33/06 ,  H01L33/32 ,  H01L33/50 ,  H01L33/54

    Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

    SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS
    3.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS 审中-公开
    半导体发光装置和发光装置

    公开(公告)号：US20150340549A1

    公开(公告)日：2015-11-26

    申请号：US14817750

    申请日：2015-08-04

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： JONG IN YANG ,  YONG IL KIM ,  KWANG MIN SONG ,  WAN TAE LIM ,  SE JUN HAN ,  HYUN KWON HONG

    IPC: H01L33/00 ,  H01L33/38 ,  H01L27/15

    CPC classification number: H01L33/0075 ,  H01L27/156 ,  H01L33/20 ,  H01L33/38 ,  H01L33/382 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0016

    Abstract: A semiconductor light emitting device includes a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first internal electrode, a second internal electrode, an insulating part, and first and second pad electrodes. The active layer is disposed on a first portion of the first conductive semiconductor layer, and has the second conductive layer disposed thereon. The first internal electrode is disposed on a second portion of the first conductive semiconductor layer separate from the first portion. The second internal electrode is disposed on the second conductive semiconductor layer. The insulating part is disposed between the first and second internal electrodes, and the first and second pad electrodes are disposed on the insulating part to connect to a respective one of the first and second internal electrodes.

    Abstract translation: 半导体发光器件包括第一导电半导体层，有源层，第二导电半导体层，第一内部电极，第二内部电极，绝缘部分以及第一和第二焊盘电极。 有源层设置在第一导电半导体层的第一部分上，并且其上设置有第二导电层。 第一内部电极设置在与第一部分分离的第一导电半导体层的第二部分上。 第二内部电极设置在第二导电半导体层上。 绝缘部分设置在第一和第二内部电极之间，并且第一和第二焊盘电极设置在绝缘部分上以连接到第一和第二内部电极中的相应一个。

    LIGHT EMITTING DEVICE PACKAGE
    4.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 有权

    公开(公告)号：US20170338210A1

    公开(公告)日：2017-11-23

    申请号：US15386425

    申请日：2016-12-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： YONG IL KIM ,  Wan Tae LIM ,  Young Jin CHOI ,  Sung Hyun SIM

    IPC: H01L25/16 ,  H01L33/32 ,  H01L27/12 ,  H01L33/06 ,  H01L33/54 ,  H01L33/50

    CPC classification number: H01L25/167 ,  H01L27/124 ,  H01L33/06 ,  H01L33/32 ,  H01L33/50 ,  H01L33/54

    Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

    LIGHT EMITTING DIODE DISPLAY DEVICE
    6.
    发明申请
    LIGHT EMITTING DIODE DISPLAY DEVICE 审中-公开

    公开(公告)号：US20190312083A1

    公开(公告)日：2019-10-10

    申请号：US16205454

    申请日：2018-11-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Tan SAKONG ,  YONG IL KIM ,  Jong Uk SEO ,  Ji Hye YEON

    IPC: H01L27/15 ,  H01L33/50

    Abstract: A light emitting diode display device is provided. The light emitting diode display device includes a first light emitting diode pixel including a first light emitting diode layer and a first color conversion material on the first light emitting diode layer, a second light emitting diode pixel including a second light emitting diode layer and a second color conversion material on the second light emitting diode layer, a separation film disposed between the first light emitting diode layer and the second light emitting diode layer and a partition disposed between the first color conversion material and the second color conversion material and including a partition material, wherein the first and second light emitting diode pixels are divided by the separation film and the partition, the partition is disposed on the separation film in alignment with the separation film such that the partition includes linear portions that extend in a first direction and the separation film includes linear portions that also extend in the first direction and vertically overlap the linear portions of the partition, and the partition material includes an insulating material different from silicon.

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