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1.发明申请公开(公告)号：US20250046727A1
公开(公告)日：2025-02-06
申请号：US18426730
申请日：2024-01-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jeongdu KIM , Sunghyup KIM , Woongkee KIM
IPC: H01L23/544 , H01L21/02
Abstract: A wafer includes: a scribe lane surrounding a semiconductor chip region on one surface of the wafer body; and a stress adjustment portion in the scribe lane and including a first film and a second film that have at least different materials from that of the wafer body. The wafer may be provided before a semiconductor process.
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