公开(公告)号：US20250046727A1

公开(公告)日：2025-02-06

申请号：US18426730

申请日：2024-01-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongdu KIM ,  Sunghyup KIM ,  Woongkee KIM

IPC: H01L23/544 ,  H01L21/02

Abstract: A wafer includes: a scribe lane surrounding a semiconductor chip region on one surface of the wafer body; and a stress adjustment portion in the scribe lane and including a first film and a second film that have at least different materials from that of the wafer body. The wafer may be provided before a semiconductor process.

公开(公告)号：US20230207369A1

公开(公告)日：2023-06-29

申请号：US17893659

申请日：2022-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonggu LEE ,  Sunghyup KIM ,  Jeongdu KIM ,  Hyeonjin KIM ,  Junghwan KIM

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/68742 ,  H01L21/6875

Abstract: A wafer chuck table includes a center plate having a plurality of first protrusions each having an upper end at least partially defining a first reference plane, segmented plates arranged around the center plate and having a plurality of second protrusions, each having an upper end at least partially defining a second reference plane such that the segmented plates have separate, respective pluralities of second protrusions at least partially defining separate, respective second reference planes, and driving units configured to adjust an inclination angle of the segmented plates with respect to the center plate so that the first reference plane and the separate, respective second reference planes are coplanar.

公开(公告)号：US20230191547A1

公开(公告)日：2023-06-22

申请号：US17940265

申请日：2022-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongdu KIM ,  Sunghyup KIM ,  Hyeonjin KIM ,  Jonggu LEE ,  Dongkyeng HAN

IPC: B23Q3/15 ,  H01L21/683

CPC classification number: B23Q3/15 ,  H01L21/6833

Abstract: An apparatus includes a chuck having an upper surface configured to support a substrate; a fixing unit configured to generate chucking force to fix the substrate to the chuck in a first perpendicular direction and applying the chucking force to the substrate; and a controller configured to divide the chuck into a plurality of zones on a plane perpendicular to the first direction, based on reference overlay distribution corresponding to a degree of overlay deterioration when the substrate is fixed to the upper surface of the chuck, and individually control respective magnitudes of the chucking force applied to each of the plurality of zones. The controller is configured to reduce a magnitude of chucking force applied to a zone including a region having a high degree of overlay deterioration, among the plurality of zones, in the reference overlay distribution.