公开(公告)号：US20190198489A1

公开(公告)日：2019-06-27

申请号：US16162598

申请日：2018-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Choon KIM ,  Young-Deuk KIM ,  Woo-Hyun PARK

IPC: H01L25/18 ,  H05K1/18 ,  H01L23/427

Abstract: An electronic device includes a substrate, a first electronic product arranged on the substrate, a second electronic product arranged on the substrate to be spaced apart from the first electronic product, and a heat dissipating assembly covering the first and second electronic products, the heat dissipating assembly comprising a heat dissipating chamber including a hermetically sealed space having a first portion having one or more gaps in which a flowable heat dissipation fluid is disposed and having a second portion in which a solid thermal conductive member is disposed to prevent the flow of the heat dissipation fluid across the second portion with respect to a plan view, wherein the first portion of the heat dissipating chamber has a first thermal conductivity and overlaps with the first electronic product in the plan view, wherein the solid thermal conductive member has a second thermal conductivity less than the first thermal conductivity, wherein the solid thermal conductive member overlaps with the second electronic product in the plan view, wherein the overlapping area of the solid thermal conductive member with the second electronic product is greater than 50% of an area of the second electronic product in the plan view.