公开(公告)号：US09026969B2

公开(公告)日：2015-05-05

申请号：US14203650

申请日：2014-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myung-Soo Jang ,  Jae-Rim Lee ,  Jong-Wha Chong ,  Min-Beom Kim ,  Wen Rui Li ,  Cheol-Jon Jang

IPC: G06F17/50 ,  G06F9/455

CPC classification number: G06F17/5081 ,  G06F17/5072 ,  G06F17/5077

Abstract: A method of designing arrangement of through silicon vias (TSVs) in a stacked semiconductor device is provided The method includes: determining a plurality of TSV candidate grids representing positions, into which the TSVs are insertable, in each of a plurality of semiconductor dies stacked mutually and included in a stacked semiconductor device; creating a plurality of path graphs representing linkable signal paths for a plurality of signals transmitted through the stacked semiconductor device, respectively, based on the TSV candidate grids; determining initial TSV insertion positions corresponding to shortest signal paths for the signals based on the path graphs; and determining final TSV insertion positions by verifying the initial TSV insertion positions so that a plurality of signal networks corresponding to the shortest signal paths for the signals have routability.

Abstract translation: 提供了一种设计堆叠半导体器件中的硅通孔（TSV）布置的方法。该方法包括：确定多个TSV候选栅格，TSV候选栅格表示可插入的多个半导体管芯中相互堆叠的多个半导体管芯中的每一个中的位置 并且包括在堆叠的半导体器件中; 基于所述TSV候选网格，分别创建表示通过所述堆叠半导体器件传输的多个信号的可链接信号路径的多个路径图; 基于路径图确定对应于信号的最短信号路径的初始TSV插入位置; 以及通过验证初始TSV插入位置来确定最终的TSV插入位置，使得对应于信号的最短信号路径的多个信号网络具有可路由性。