-
公开(公告)号:US20250056861A1
公开(公告)日:2025-02-13
申请号:US18583006
申请日:2024-02-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: SOOJIN JEONG , MYUNG GIL KANG , DONGWON KIM , BEOMJIN PARK , DONGSUK SHIN , HYUN-KWAN YU , WOOSUK CHOI , SEUNGPYO HONG
IPC: H01L29/66 , H01L21/8238 , H01L23/528 , H01L27/092 , H01L29/06 , H01L29/08 , H01L29/423 , H01L29/775 , H01L29/786
Abstract: A semiconductor device includes a substrate including an active pattern, a channel pattern on the active pattern, the channel pattern including a plurality of semiconductor patterns that are spaced apart from each other, a source/drain pattern electrically connected to the plurality of semiconductor patterns, an inner gate electrode between adjacent first and second semiconductor patterns of the plurality of semiconductor patterns, an inner gate insulating layer between the inner gate electrode and the first and second semiconductor patterns, an inner high-k dielectric layer between the inner gate electrode and the inner gate insulating layer, and an inner spacer between the inner gate insulating layer and the source/drain pattern. As the inner gate insulating layer includes an inner gate spacer, the inner gate electrode may stably fill the inner gate space. As a result, the electrical characteristics of the semiconductor device may be improved.