公开(公告)号：US20220262621A1

公开(公告)日：2022-08-18

申请号：US17478619

申请日：2021-09-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongkeun CHO ,  Young Hoo KIM ,  Seung Min SHIN ,  Tae Min EARMME ,  Kun Tack LEE ,  Hun Jae JANG ,  Eun Hee JEANG

IPC: H01L21/02 ,  H01L21/687 ,  H01L21/428 ,  B08B3/08

Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.

公开(公告)号：US20230154743A1

公开(公告)日：2023-05-18

申请号：US18098330

申请日：2023-01-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： SeongKeun CHO ,  Young Hoo KIM ,  Seung Min SHIN ,  Tae Min EARMME ,  Kun Tack LEE ,  Hun Jae JANG ,  Eun Hee JEANG

IPC: H01L21/02 ,  B08B3/08 ,  H01L21/428 ,  H01L21/687

CPC classification number: H01L21/02057 ,  B08B3/08 ,  H01L21/428 ,  H01L21/68764

Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.