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公开(公告)号:US11903147B2
公开(公告)日:2024-02-13
申请号:US17069965
申请日:2020-10-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hangyu Hwang , Youngjong Shin , Sangbeom Ko , Sungho Cho , Sunyoung Ji , Younghee Choi , Changyoun Hwang
CPC classification number: H05K5/0004 , B29C45/372 , H04M1/0283 , B29L2031/3475
Abstract: An electronic device and method for forming a housing of the same is disclosed. The electronic device includes: a housing including: a first plate forming a front surface of the housing, a second plate integrally forming a rear surface and side surface of the housing, wherein a space is enclosed between the front surface, side surface and rear surface, and wherein the second plate includes a first surface forming the side and rear surfaces of the housing, and a second surface disposed opposite to the first surface, and a display disposed in the space and at least partially visible through the first plate, wherein at least a portion of the second surface includes a pattern having surface roughness having a height of 0.1 μm to 1 μm.
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公开(公告)号:US12204379B2
公开(公告)日:2025-01-21
申请号:US17883259
申请日:2022-08-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hwanju Jeon , Jungtaek Lee , Sunghoon Cho , Sunyoung Ji
Abstract: An electronic device includes a housing including a translucent ceramic member; and a printing film provided on the housing, wherein the printing film includes: an adhesive layer provided on the ceramic member; a base layer including a first surface facing the adhesive layer and a second surface opposite to the first surface; a printing layer provided on the first surface or the second surface of the base layer, the printing layer being viewable through the ceramic member and the adhesive layer; and a shielding printing layer facing the second surface of the base layer.
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