公开(公告)号：US09991426B2

公开(公告)日：2018-06-05

申请号：US15401604

申请日：2017-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-mok Hong ,  Kyung-wook Hwang

IPC: H01L33/00 ,  H01L33/46 ,  H01L33/62 ,  H01L33/52 ,  H01L33/50 ,  H01L33/64 ,  H01L33/48 ,  H01L21/764

CPC classification number: H01L33/46 ,  H01L21/764 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/52 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light-emitting device package includes a supporting substrate, a light-emitting device on the supporting substrate, an adhesive layer on at least a portion of a side surface or lower surface of the light-emitting device, the adhesive layer connecting the light-emitting device to the supporting substrate, and an air layer in a space defined by the supporting substrate, the light-emitting device, and the adhesive layer.